Line pattern manufacturing method

Abstract

The invention provides a line pattern manufacturing method. The method includes the following steps of firstly, forming a base material, secondly, attaching a metal material to the base material so as to form a line base layer on the base material, wherein the line base layer forms a curved surface structure along a curved line of the surface of the base material, thirdly, forming an anti-plating layer on the line base layer, fourthly, etching the line base layer, removing the metal material which is not covered by a line pattern of the anti-plating layer from the base material in an etching mode and enabling the line base layer to form a line pattern, and finally, removing the anti-plating layer so as to enable the line base layer with the line pattern to be exposed out of the surface of the base material. Therefore, manufacturing cost of the line patterns can be reduced, and manufacturing quality of the line patterns are improved.

Description

technical field [0001] The invention relates to a circuit pattern, in particular to a method for manufacturing the circuit pattern. Background technique [0002] figure 1 and figure 2 is a schematic diagram of a conventional antenna structure 100, 100'. like figure 1 It shows a laser active layer 12 formed on a substrate 11 by using a laser direct structuring (Laser Direct Structuring, LDS) process. The substrate 11 may be a casing of a mobile device (eg, a smart phone). Since some areas are not fully activated by the laser, unevenness occurs (the dotted line is the ideal line width), such as jump plating, which may affect the overall effect of the antenna structure. another example figure 2 As shown, when some substrates 11 with through holes are activated with laser beam L, due to the influence of factors such as the size and shape of the through holes, the angle of the laser, some areas in the hole walls may not be fully activated by the laser, and then The upper...

AI Technical Summary

Problems solved by technology

The possible problems caused by the above-mentioned laser direct forming antenna structure are worthy of further improvement in the manufacture of antennas or other related conductive circuits in this field

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