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A pickling solution for copper base material with corrosion inhibition effect

A substrate acid and corrosion inhibition technology, which is applied in the field of copper substrate pickling solution, can solve the problems of poor biodegradability, low corrosion inhibition efficiency of corrosion inhibitors, and high cost, and achieve cheap raw materials, stable corrosion inhibition performance, and applicable strong effect

Inactive Publication Date: 2016-04-20
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to achieve the above object, the technical solution of the present invention aims at the defects of low corrosion inhibition efficiency, high cost and poor biodegradability of the corrosion inhibitor in the copper substrate pickling solution in the background technology, and adopts cyproconazole which is conventionally used as a plant fungicide (2-(4-Chlorophenyl)-3-cyclopropyl-1-(1H-1,2,4-triazol-1-yl)butan-2-ol) was added to the acid solution as a corrosion inhibitor to prepare A pickling solution for copper substrates with corrosion inhibition effect

Method used

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  • A pickling solution for copper base material with corrosion inhibition effect
  • A pickling solution for copper base material with corrosion inhibition effect
  • A pickling solution for copper base material with corrosion inhibition effect

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Experimental program
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Effect test

Embodiment 1

[0020] The acid solution in the pickling solution is dilute nitric acid, the concentration is 0.5mol / L, the amount of pickling solution is 1L, add 2-(4-chlorophenyl)-3-cyclopropyl-1-(1H-1,2, 4-triazol-1-yl)butan-2-ol 10 -3 mol / L, under the condition of 25°C, immerse the metal copper to be cleaned in the pickling solution for 10 days in the weight loss test; soak for 1 hour in the electrochemical test.

[0021] The highest corrosion inhibition efficiency obtained through the weight loss test is 88.7%, the electrochemical impedance spectroscopy test results show that the corrosion inhibition efficiency is 98.7%, the potentiodynamic polarization curve test results show that the corrosion inhibition efficiency is 99.7%, and the corrosion inhibition efficiency in the pickling treatment solution shown to be effective corrosion inhibitors.

Embodiment 2

[0023] The acid solution in the pickling solution is dilute nitric acid and dilute sulfuric acid, the concentration is 0.5mol / L respectively, the amount of pickling solution is 100L, add 2-(4-chlorophenyl)-3-cyclopropyl-1-(1H- The amount of 1,2,4-triazol-1-yl)butan-2-ol is 10 -3 mol / L, immerse the copper clad laminate to be cleaned in the pickling solution for 15 days at 25°C.

[0024] The highest corrosion inhibition efficiency obtained by the weight loss test is 90%, and the corrosion inhibitor in the pickling treatment solution is shown to be an efficient corrosion inhibitor.

Embodiment 3

[0026] The acid liquid in the pickling liquid is dilute sulfuric acid, the concentration is 0.5mol / L, the amount of pickling liquid is 10L, add 2-(4-chlorophenyl)-3-cyclopropyl-1-(1H-1,2, The amount of 4-triazol-1-yl)butan-2-ol is 10 -3 mol / L, immerse the metal copper to be cleaned in the pickling solution for 20 days in the weight loss test at 15°C; soak for 2 hours in the electrochemical test.

[0027] The highest corrosion inhibition efficiency obtained by weight loss test is 82.1%, the electrochemical impedance spectroscopy test results show that the corrosion inhibition efficiency is 93.7%, the potentiodynamic polarization curve test results show that the corrosion inhibition efficiency is 84.1%, and the corrosion inhibition efficiency in the pickling treatment solution shown to be effective corrosion inhibitors.

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Abstract

The invention belongs to a copper substrate pickling solution with corrosion inhibiting effect, and relates to the pickling / micro-etching treatment process before electroplating copper in the manufacture of printed circuit boards, specifically to prevent copper and corrosion on the surface of printed circuit boards. It is a pickling solution for copper substrates with corrosion inhibition effect for the over-corrosion of copper metal by acid medium in the process of pickling / micro-etching. The present invention aims at defects such as high corrosion inhibitor cost, low corrosion inhibition efficiency, and poor biodegradability in common copper substrate pickling liquids, and adopts cyproconazole (2-(4-chlorophenyl)- 3-cyclopropyl-1-(1H-1,2,4-triazol-1-yl)butan-2-ol) is added into the acid solution as a corrosion inhibitor to prepare copper substrate pickling with corrosion inhibition effect liquid. The amount of cyproconazole used as a corrosion inhibitor in the pickling solution is small, cheap and easy to obtain, and can be naturally degraded in sunlight without environmental problems after use, which is in line with the development trend of green corrosion inhibitors; and has high corrosion inhibition efficiency , It can reach 80-99%, and the corrosion inhibition performance is stable.

Description

technical field [0001] The invention belongs to a copper substrate pickling solution with corrosion inhibiting effect, and relates to the pickling / micro-etching treatment process before electroplating copper in the manufacture of printed circuit boards, specifically to prevent copper and corrosion on the surface of printed circuit boards. It is a pickling solution for copper substrates with corrosion inhibition effect for over-corrosion of metal copper by acid medium in the process of pickling / micro-etching. Background technique [0002] Metal copper is the most widely used and used in the electrical and electronic industries, accounting for more than half of the total consumption. Used in the manufacture of various printed circuit boards, motors, transformers, switches, cables and wires, printed circuit boards are an important electronic material, it is the support of electronic components, and the main carrier for the electrical connection of electronic components . The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23G1/06C23G1/10
Inventor 陶志华何为王守绪郑莉王韬
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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