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Electronic component module and its manufacturing method
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A technology for electronic parts and a manufacturing method, which is applied in the field of packaging structure of electronic parts, can solve the problems of difficulty in identification identification, inability to ensure traceability, etc., and achieve the effect of ensuring traceability
Inactive Publication Date: 2016-04-13
ALPS ALPINE CO LTD
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[0006] However, in the above-mentioned conventional example, since the dye or pigment containing a fluorescent substance that develops color with a wavelength of 300nm to 450nm is marked on the surface of the part, the dye or pigment containing the fluorescent substance on the surface of the part If it peels off or if the surface of the part is stained, it becomes difficult to recognize the mark, and there is a problem that traceability cannot be ensured
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no. 1 Embodiment approach
[0037] Hereinafter, the electronic component module 100 according to the first embodiment of the present invention will be described.
[0038] First, use figure 1 The structure of the electronic component mold 100 of the first embodiment will be described. figure 1 is a diagram showing the structure of the electronic component module 100, figure 1 (a) is a top view of the electronic component module 100 viewed from above, figure 1 (b) is from figure 1 (a) Cross-sectional view of A-A cross-section observation.
[0039] Electronic parts module 100 such as figure 1 As shown, a substrate 1, a plurality of electronic components 2 such as chip components 2a and IC 2b mounted on one surface of the substrate 1, a sealing member 3 for sealing the electronic components 2, and a coating to seal the sealing member 3 are provided. Protective parts for surface covering4.
[0040] The substrate 1 is a resin substrate made of glass fiber, resin, etc., or a ceramic substrate using ...
no. 2 Embodiment approach
[0054] Hereinafter, as the second embodiment of the present invention, the method for manufacturing the electronic component module 100 will be used image 3 Be explained.
[0055] image 3 It is a figure explaining the manufacturing process of the electronic component module 100 concerning 2nd Embodiment of this invention, image 3 (a) to image 3 (e) shows the cross section of the die set in each process.
[0056] First, if image 3 As shown in (a), a plurality of electronic components 2 constituting the circuit of the electronic component module 100 such as chip components 2 a and IC 2 b are mounted on one surface of the substrate 1 .
[0057] Next, if image 3 As shown in (b), the entire one surface of the substrate 1 on which a plurality of electronic components 2 are mounted is sealed with a dark-colored sealing member 3 .
[0058] After sealing is completed, if image 3 As shown in (c), various product information required for traceability are recorded on the sur...
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Abstract
The invention provides an electronic component module and a method for manufacturing the same. The electronic component module comprises a substrate (1), plural electronic components (2) arranged on one surface of the substrate (1), a sealing part (3) for sealing the abovementioned electronic components (2), and a protective part (4) coated for covering the surface of the sealing part (3). In the electronic component module, the surface of the sealing part (3) is subjected to first stamp marking (5), the coated protective part (4) is used to cover the first stamp marking (5), and the surface of the protective part (4) is subjected to second stamp marking (6), so that product information required by traceability is recorded effectively in a limited region, and even if the marking on the component surface is damaged, the first stamp marking (5) can be identified by removing part or whole of the protective part (4), thereby ensuring the traceability.
Description
technical field [0001] The present invention relates to a packaging structure of electronic parts, in particular to a packaging structure of electronic parts capable of marking a lot of information in a limited area. Background technique [0002] Conventionally, for the purpose of ascertaining the cause of failure of electronic equipment equipped with electronic component modules, it has been common to print product-specific information such as product names and manufacturing lot numbers on the upper surface of electronic component modules, that is, the appearance A so-called logo on an easily identifiable surface. [0003] In recent years, due to the high traceability (traceability) of quality control information and distribution management information, etc., the amount of information related to traceability has increased. Due to the increase in performance, there is a strong demand for miniaturization of electronic component modules mounted in electronic equipment, and th...
Claims
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Application Information
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