Novel copper-coated modified aluminium alloy bimetal compounding conducting wire

Abstract

A novel copper-coated modified aluminium alloy bimetal compounding conducting wire is produced by the compounding of core layer metal modified aluminium alloy and coating layer metal copper, and is characterized in that interfaces of the core layer metal modified aluminium alloy and the coating layer metal copper are in metallurgical bonding. The matching rate of each component in the modified aluminium alloy is as follows by weight percent: 97.8% aluminium, 0.5-0.9% magnesium, 0.45-0.65% silicon, and 0.4-0.7% RE; the proportional region of cross-sectional area of finished product coated layer metal copper is 10%-20%; the wire diameter of finished product copper-coated modified aluminium alloy wire is Phi 0.014 mm-Phi 8.0 mm. According to the conducting wire, the interfaces of copper and aluminium reach the metallurgical bonding; the technological process is short; the production efficiency is high; the product cost is low; the conducting wire is suitable for large-scale and normalized industrial production.

Description

technical field [0001] The invention belongs to the technical field of bimetallic composite wires, and in particular relates to a novel copper-clad modified aluminum alloy bimetallic composite wire and a production method thereof. Background technique [0002] Since the 1960s and 1970s, the cladding method has been widely used to produce bimetallic composite wires such as copper-clad aluminum and copper-clad steel. The United States, Japan and other countries have formed large-scale industries, and each has its own patented technology with certain characteristics. For example: Copper-clad aluminum wires produced by Copewell Company of the United States occupied the main domestic market before 1997; another example, Fujikura Wire Co., Ltd. of Japan developed composite wires in the 1970s, and the company produced small-diameter wires. Copper-clad aluminum magnet wire still occupies the market of the domestic electronics industry. [0003] In the late 1960s, my country tried ...

AI Technical Summary

Problems solved by technology

The more common method is the casing drawing method. Due to the limitations of its equipment and process, the performance and quality of the product are poor and cannot be continuously produced.