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Method of modifying a boundary region of a substrate

A substrate and boundary technology, applied in the direction of gaseous chemical plating, coating, metal material coating process, etc., can solve the problems of long process time, uneconomical, limited applicability, etc., achieve uniform treatment or coating, avoid damage effect

Inactive Publication Date: 2013-12-04
SULZER METRO AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The disadvantage in this respect is that the process times required for processing the substrate are very long, in some cases up to 100 hours, which is uneconomical for many industrial applications and has only limited applicability

Method used

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  • Method of modifying a boundary region of a substrate
  • Method of modifying a boundary region of a substrate

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Embodiment Construction

[0058] figure 1 An embodiment of a plasma modification plant 1 for modifying a boundary region 9 of a substrate 3 delimited by a surface 10 is shown, wherein an evacuated process chamber 2 is provided with a plasma source 4 for generating a directed plasma A fluid flow 5 , wherein the reaction components are also supplied into the process chamber 2 with a flow rate of a predefined magnitude and the substrate 3 is heated to a predefined reaction temperature. According to the invention, the reactive components are diffusely activated by means of the directed plasma flow 5 such that the reactive components diffuse into the boundary region 11 of the substrate 3 with a predefined diffusion rate.

[0059] A plasma coating plant 1 comprises a process chamber 2 with a plasma source 4 for generating a plasma flow 5, a controlled pump device and a substrate holder 8 for holding a substrate 3, the pump device being in figure 1 is not shown in and is connected to the process chamber 2 to...

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Abstract

A method of modifying a boundary region (9) of a substrate (3) bounded by a surface (10), wherein an evacuated process chamber (2) is provided having a plasma source (4) for generating a directed plasma jet (5), and wherein furthermore a reactive component is supplied into the process chamber (2) with a flow of a predefined size, and wherein the substrate (3) is heated to a predefined reaction temperature, characterized in that the reactive component is diffusion-activated by the directed plasma jet (5) such that the reactive component diffuses into the boundary region (11) of the substrate (3) at a predefinable diffusion rate.

Description

technical field [0001] The invention relates to a method of modifying a boundary region of a substrate delimited by a surface according to the preamble of independent claim 1 . Background technique [0002] Surface polishing is understood to be the most varied technical method of enhancing or modifying the surface properties of a substrate. Basically, in this respect, the functional and decorative properties of the substrate surface are modified, where functional properties mean enhancement of the surface, eg with respect to corrosion protection or wear protection, or decorative properties mean eg gloss level or colour. Known examples of products aimed at surface polishing are plastic or metal parts, such as DVDs or tools, whose scratch resistance is improved, or the production of antifouling agent surfaces on glass and ceramics (lotus effect). [0003] Two process categories for surface polishing are coating processes and modification of layer regions in substrates. The m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/12C23C4/02C23C8/36
CPCC23C16/513C23C4/127C23C4/134C23C8/00
Inventor M.金德拉特P.吉蒂恩C.霍伦施泰因
Owner SULZER METRO AG
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