A cutting process of sapphire crystal rod and its processing jig

Abstract

The invention discloses a cutting technique and a machining fixture for a sapphire ingot. The cutting technique comprises the following steps of firstly, bonding the machining fixture for fixing the ingot to a base of a multi-wire cutting machine and enabling the bottom surface of the machining fixture to be parallel to that of the multi-wire cutting machine; secondly, after bonding and curing the machining fixture and the base of the multi-wire cutting machine, fixedly bonding the sapphire ingot in an arc-shaped positioning groove in the machining fixture, enabling the end face of the sapphire ingot to be parallel to that of the machining fixture and ensuring the crystal orientation of a cutting-in surface of the sapphire ingot; thirdly, starting the multi-wire cutting machine, sequentially cutting the sapphire ingot and the machining fixture from the crystal orientation of a cutting-in surface of the sapphire ingot by matching a wire saw with a cutting fluid until the sapphire ingot is completely cut off. According to the cutting technique and the machining fixture disclosed by the invention, the sapphire ingot is cut by combining the cutting technique with the machining fixture, so that a plurality of sapphire ingots can be cut at one time; the production efficiency is high and the cutting quality is good.

Description

technical field [0001] The invention belongs to the field of sapphire glass processing, and in particular relates to a cutting process of a sapphire crystal rod. Background technique [0002] At present, multi-wire cutting machines are used to cut sapphire ingots. The traditional diamond wire saw has a low service life and can only cut three times repeatedly. Moreover, the number of bars cut at the same time is small, and the cutting efficiency is low. , and the sapphire ingot with a smaller cutting size is even less advanced, and there is no practical and effective cutting process for cutting a crystal ingot with a diameter of 12mm or less. Contents of the invention [0003] The technical purpose of the present invention is to provide a cutting process for sapphire crystal rods, which is used to overcome the defects of low efficiency and difficulty in cutting small-sized crystal rods in the existing sapphire crystal rod cutting process. [0004] The present invention ado...

AI Technical Summary

Problems solved by technology

[0003] The technical purpose of the present invention is to provide a cutting process for sapphire crystal rods to overcome the defects of low efficiency and difficulty in cutting small-sized crystal rods in the existing sapphire crystal rod cutting process

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