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Granularly-separable ceramic substrate and separation method thereof

A ceramic substrate and separation method technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reducing the strength of the ceramic substrate body, fragility, and high production costs of packaged products, so as to improve production efficiency and economy. Benefits, enhanced mechanical strength, and improved production yield

Pending Publication Date: 2019-04-26
APT ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the semiconductor packaging industry, the separation method used for ceramic substrates is usually water jet or laser cutting, and the corresponding cutting equipment is complicated and expensive, which makes the production cost of packaging products high.
[0003] Moreover, in actual production, pre-cutting is usually performed during the production of ceramic substrates, but the existence of cutting lines will reduce the strength of the ceramic substrate, making it prone to fragility during the production process; moreover, when the ceramic substrate is separated into For a single piece, no matter whether it is broken by hand or by a machine, it will cause a certain number of single pieces to break and have burrs, making the production yield of the product low

Method used

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  • Granularly-separable ceramic substrate and separation method thereof
  • Granularly-separable ceramic substrate and separation method thereof
  • Granularly-separable ceramic substrate and separation method thereof

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Embodiment 1

[0032] Such as Figure 1-3 As shown, the present embodiment provides a granular-separable ceramic substrate 100 , including a substrate body 1 and a circuit unit 2 disposed on the substrate body 1 .

[0033] The planar cross-sectional area of ​​the substrate body 1 is rectangular, and the planar cross-sectional area of ​​the circuit unit 2 arranged on the substrate body 1 is also rectangular, and arranged in an array on the upper end surface of the substrate body 1, In order to facilitate subsequent processing and production. The material of the substrate in this embodiment is a common ceramic material such as alumina, zirconia, aluminum nitride, etc., and the ceramic material contains conventional doping components. The circuit unit 2 can be provided with several according to the actual production situation, and each circuit unit 2 is provided with a printed circuit that can realize its own electrical function; It can still be used alone after separation.

[0034] Further,...

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Abstract

The invention discloses a granularly-separable ceramic substrate. The granularly-separable ceramic substrate comprises a substrate body, wherein the substrate body is provided with a circuit unit, andthe substrate body is provided with mutually communicated upper cutting grooves around the circuit unit, the upper cutting grooves are provided with filling lines made of a metal conductive material,and en external electrode connected with the filling lines and used for connecting with a power supply device is arranged on the substrate body; the circuit unit is arranged on one side of the substrate body, and lower cutting grooves corresponding to the upper cutting grooves are formed in the other side surface of the substrate body. A separation method based on the ceramic substrate is provided. The strength of the substrate body of the granularly-separable ceramic substrate in the production process can be effectively ensured, the ceramic substrate is easy to separate, and the quality ofthe ceramic substrate in the granular separation can be ensured.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a granular-separatable ceramic substrate and a separation method thereof. Background technique [0002] At present, in the semiconductor packaging industry, the separation method used for ceramic substrates is usually water jet or laser cutting, and the corresponding cutting equipment is complicated and expensive, which makes the production cost of packaging products high. [0003] Moreover, in actual production, pre-cutting is usually performed during the production of ceramic substrates, but the existence of cutting lines will reduce the strength of the ceramic substrate, making it prone to fragility during the production process; moreover, when the ceramic substrate is separated into For a single chip, no matter whether it is broken by hand or by a machine, it will cause a certain number of single products to be broken and have burrs, which makes th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/304
CPCH01L21/3043H01L21/78
Inventor 刘桂良姜志荣陈健进江风强曾照明
Owner APT ELECTRONICS
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