Method for preparing multilayer low-temperature cofired ceramics integrated liquid cooling circulation channel

A low-temperature co-fired ceramic and circulating channel technology, which can be used in semiconductor/solid-state device manufacturing, antenna support/installation devices, electrical components, etc., and can solve problems such as no bulging and no delamination.

Active Publication Date: 2013-12-18
10TH RES INST OF CETC
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Problems solved by technology

[0007] The purpose of the present invention is to address the above-mentioned shortcomings of the existing LTCC process technology, and propose a new manufacturing proce

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  • Method for preparing multilayer low-temperature cofired ceramics integrated liquid cooling circulation channel
  • Method for preparing multilayer low-temperature cofired ceramics integrated liquid cooling circulation channel
  • Method for preparing multilayer low-temperature cofired ceramics integrated liquid cooling circulation channel

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[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0017] see figure 1 . According to the present invention, after the fabrication steps are determined, the determination of the process parameters is the key to ensure the fabrication of the closed cavity, and the main influencing factors are: alignment accuracy, lamination pressure, lamination temperature, filling density, and sintering temperature. The low-temperature sintered ceramic powder is made into a green ceramic tape with precise and dense thickness, and the required circuit patterns and wiring patterns are produced on the green ceramic tape by punching, micro-hole grouting, and precision conductor paste printing. Passive components, such as low-capacitance capacitors, resistors, filters, impedance converters, couplers, etc., are embedded in a multi-layer ceramic substrate, then stacked together and sintered at 900 °C to make high-density non-...

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Abstract

The invention provides a method for preparing a multilayer low-temperature cofired ceramics integrated liquid cooling circulation channel. By the adoption of the method, the fact that the liquid cooling circulation channel does not collapse can be guaranteed, and the problems of layering and swelling in the sintering process can be solved. According to the technical scheme, the method is achieved through the following steps that firstly, a plurality of low-temperature cofired raw ceramic chips are divided into three layers, locating holes, via holes, heat radiating holes and the liquid cooling circulation channel are prepared respectively, then, integral lamination is conducted on the top raw ceramic chip layer with an antenna unit to form a top unit, and integral lamination is conducted on the middle raw ceramic chip layer with the liquid cooling circulation channel and the bottom raw ceramic chip layer with a TR component unit to form a pit unit; volatilizable filling materials are printed into pits of the pit unit, organic adhesive coats the surface of the pit unit, the top unit is stacked on the pit unit, and an integral module is formed in a low-temperature and low-pressure mode; the integral module which is laminated is placed in a sintering furnace for sintering, and a liquid cooling external joint is welded to a corresponding liquid cooling inlet and outlet on the surface of the top layer of the module.

Description

technical field [0001] The invention relates to a manufacturing process method for manufacturing a multi-layer low temperature cofired ceramic substrate (Low Temperature Cofired Ceramics, LTCC for short) with a closed cavity forming an integrated liquid cooling channel. In particular, the method is specially used for the fabrication process of the front end of the radio frequency antenna integrated with the liquid-cooled circulating microchannel. Background technique [0002] In the fifth generation of electronic assembly technology, multilayer low temperature co-fired ceramic substrate (LTCC) can embed passive components and realize hermetic packaging due to its high-density wiring, high signal transmission speed, low loss and high reliability. It has excellent electronic, mechanical and thermal properties, excellent high-frequency characteristics, and strong three-dimensional wiring capabilities. It is an important technical approach for the development of microwave integr...

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Application Information

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IPC IPC(8): H01L21/48H01Q1/22
Inventor 阎德劲冯刚英周宇戈
Owner 10TH RES INST OF CETC
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