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Semiconductor structure with improved channel stack and method for fabrication thereof

A semiconductor, stacking technology used in semiconductor/solid-state device manufacturing, semiconductor devices, electro-solid devices, etc., to solve problems such as diffusion of dopant materials, degradation of performance, and interference with reliable transistor operation

Active Publication Date: 2013-12-18
MIE FUJITSU SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, implant tool limitations, required thermal treatment conditions, and material or process variations can easily lead to undesired diffusion of dopant material from the initial implant site, degrading performance or even preventing reliable transistor operation

Method used

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  • Semiconductor structure with improved channel stack and method for fabrication thereof
  • Semiconductor structure with improved channel stack and method for fabrication thereof
  • Semiconductor structure with improved channel stack and method for fabrication thereof

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Embodiment Construction

[0023] Various methods can be used to build a transistor element with a channel stack having a shielding layer for shielding the charge on the gate, a threshold voltage control layer for adjusting the threshold voltage of the transistor element, and a layer for high Mobility and reduced random doping fluctuation properties of an intrinsic channel. Each method has different advantages and disadvantages. Typically, two trade-offs are considered when building transistor elements on a semiconductor die, namely the number of steps in the process (related to manufacturing cost) and channel formation (related to transistor performance). Fewer mask steps and total steps needed to build a design translate to lower build costs. Forming the channel late in the thermal cycle of the fabrication process facilitates control of the channel doping profile and avoids the diffusion of undesired contaminants into the channel from other parts of the transistor design.

[0024] Figures 1A to 1K...

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Abstract

A method for fabricating a semiconductor structure with a channel stack includes forming a screening layer (120,110) under a gate of a PMOS transistor element (116) and a NMOS transistor element (106), forming a threshold voltage control layer (122, 112) on the screening layer, and forming an epitaxial channel layer (124) on the threshold control layer. At least a portion of the epitaxial channel layers for the PMOS transistor element and the NMOS transistor element are formed as a common blanket layer. The screening layer (120) for the PMOS transistor element (116) may include antimony as a dopant material that may be inserted into the structure prior to or after formation of the epitaxial channel layer.

Description

technical field [0001] The present disclosure generally relates to semiconductor devices and fabrication processes, and more particularly to a semiconductor structure with an improved channel stack and a method of fabrication thereof. Background technique [0002] Field effect transistors are typically fabricated on semiconductor substrates that are doped to contain mobile charge carriers. The dopant atoms can be electron donors or electron acceptors when incorporated into the semiconductor substrate lattice as a result of the activation process. An activated donor atom transfers weakly bound valence electrons to the material, creating an excess of negative charge carriers. These weakly bound electrons are relatively free to move within the semiconductor substrate lattice, facilitating conduction in the presence of an electric field applied by the gate terminal. Similarly, activated receptors generate mobile positive charge carriers called holes. Semiconductors doped with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/8238
CPCH01L21/823807H01L21/823892H01L29/665H01L29/66651H01L29/7833H01L21/76224H01L27/0928
Inventor P·E·格雷戈里L·希弗伦P·拉纳德
Owner MIE FUJITSU SEMICON
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