75 results about "Transistor design" patented technology

A method for creating a vertical double-gate transistor design includes providing a planar transistor layout (10) having a gate layer (12) overlying an active layer (14). In one embodiment, a first intermediate layer (18) is defined based on an overlapping region of the gate and active layers, and, using the first intermediate layer, a second intermediate layer (22) is defined which defines a spacing between at least two fins of the vertical double-gate transistor design. The second intermediate layer may also define a length and a width of the at least two fins. One embodiment modifies a dimension of the first intermediate layer prior to defining the second intermediate layer. The method further includes defining a resulting layer (24) based on a non-overlapping region of the second intermediate layer and the active layer. The resulting layer may then be used to create a mask and a semiconductor device (30) corresponding to the vertical double-gate transistor design.

The present invention provides a double gated transistor and a method for forming the same that results in improved device performance and density. The preferred embodiment of the present invention provides a double gated transistor with asymmetric gate doping, where one of the double gates is doped degenerately n-type and the other degenerately p-type. By doping one of the gates n-type, and the other p-type, the threshold voltage of the resulting device is improved. Additionally, the preferred transistor design uses an asymmetric structure that results in reduced gate-to-drain and gate-to-source capacitance. In particular, dimensions of the weak gate, the gate that has a workfunction less attractive to the channel carriers, are reduced such that the weak gate does not overlap the source / drain regions of the transistor. In contrast the strong gate, the gate having a workfunction that causes the inversion layer to form adjacent to it, is formed to slightly overlap the source / drain regions. This asymmetric structure allows for the performance benefits of a double gate design without the increased capacitance that would normally result.

The present invention discloses a novel ferroelectric transistor design using a resistive oxide film in place of the gate dielectric. By replacing the gate dielectric with a resistive oxide film, and by optimizing the value of the film resistance, the bottom gate of the ferroelectric layer is electrically connected to the silicon substrate, eliminating the trapped charge effect and resulting in the improvement of the memory retention characteristics. The resistive oxide film is preferably a doped conductive oxide in which a conductive oxide is doped with an impurity species. The doped conductive oxide is most preferred to be In2O3 with the dopant species being hafnium oxide, zirconium oxide, lanthanum oxide, or aluminum oxide.

Designs and fabrication of dual-gate thin film transistors are provided. An active region and a top gate electrode of the transistor can be made of a transparent thin film material. A photoresist can be coated onto a surface of the transparent conductive thin film for forming the top gate electrode. Light is from the bottom of the substrate during exposure. After the development, a photoresist pattern aligned with the bottom gate electrode is formed on the surface of the conductive thin film. The top gate electrode aligned with the bottom gate electrode is formed by etching the conductive thin film. The bottom gate electrode can be used as a mask, which may save the cost for manufacturing the transistor and improve the accuracy of alignment between the top gate electrode and the bottom gate electrode and the performance of the dual-gate thin film transistor.

Steep concentration gradients are achieved in semiconductor device of small sizes formed on SOI or double SOI wafers by using implanted polycrystalline material such as polysilicon as a solid diffusion source. Rapid diffusion of impurities along grain boundaries relative to diffusion rates in monocrystalline materials provides a substantially constant impurity concentration at the interface between polycrystalline material and monocrystalline material. Steepness of the impurity concentration gradient is thus effectively scaled as transistor size is decreased to counter increased short channel and other deleterious effects. In the case of SOI wafers greater uniformity of electrical characteristics are achieved using the high quality of semiconductor material made available therein consistent with the relatively thin active layer. In the case of double SOI, a ground plane is formed under the conduction channel which regulates the geometry of the electric field in the conduction channel with much the same functional improvements as is achieved in dual gate transistor designs.

A high density, low voltage, and low-power one time programmable (OTP) memory is based on core cells with a one transistor design. A CLEAN pulse is directed to a single shunt device at the output of the column decoder so spurious charges that may have been stored in the floating nodes can be cleaned up. Such arrangement also allows for the simultaneous initialization of bit lines, data lines, and sensing lines to zero. Core area layout size is substantially reduced, and operational power requirements are exceeding low making these particularly suitable in HF and UHF RFID applications.

A method of fabricating a CMOS integrated circuit includes the steps of providing a substrate having a semiconductor surface, forming a gate dielectric and a plurality of gate electrodes thereon in both NMOS and PMOS regions using the surface. A multi-layer offset spacer stack including a top layer and a compositionally different bottom layer is formed and the multi-layer spacer stack is etched to form offset spacers on sidewalls of the gate electrodes. The transistors designed to utilize a thinner offset spacer are covered with a first masking material, and transistors designed to utilize a thicker offset spacer are patterned and first implanted. At least a portion of the top layer is removed to leave the thinner offset spacers on sidewalls of the gate electrodes. The transistors designed to utilize the thicker offset spacer are covered with a second masking material, and the transistors designed to utilize the thinner offset spacer are patterned and second implanted. The fabrication of the integrated circuit is then completed.