Semiconductor memory device

A technology for memory devices and semiconductors, which is applied in semiconductor devices, static memories, electric solid state devices, etc., and can solve the problems of large differences in transistor characteristics and small size.

Inactive Publication Date: 2008-02-20
RENESAS TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to reduce the size of the memory cell, it is effective to use a MOS transistor with a small channel wi

Method used

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  • Semiconductor memory device
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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] FIG. 1 is a view roughly illustrating the entire configuration of a semiconductor memory device according to Embodiment 1 of the present invention.

[0039] Referring to FIG. 1, a semiconductor memory device according to Embodiment 1 of the present invention includes a memory array 1 in which memory cells MC are stacked and arranged in a matrix. Memory cells MC are arranged in (n+1) rows (m+1) columns in memory array 1 . Corresponding to each row of memory cells MC, the word lines WL0-WLn are positioned, and the memory cells MC are respectively connected to the word lines of the corresponding row. Corresponding to each column of memory cells MC, a bit line pair BL0, / BL0-BLm, / BLm is located. The memory cell MC is a static type memory cell, as will be described in detail later, and transfers complementary data to a complementary bit line pair BLi, / BLi (i=0~m).

[0040] Corresponding to each pair of bit lines BL0, / BL0-BLm, / BLm, a bit line load (BL load) BQ is formed...

Embodiment 2

[0088] In the above-described Embodiment 1, a method of suppressing an increase in variation in transistor characteristics was described by making the channel area LW of the access transistor larger than that of the drive transistor designed with the minimum design size. In Embodiment 2 of the present invention, a method for improving the difference in transistor characteristics accompanying gate interdiffusion is described.

[0089] FIG. 8 is a view for explaining gate interdiffusion. Generally, N-type and P-type impurities are each implanted into an NMOS region forming an N-channel MOS transistor and a PMOS region forming a P-channel MOS transistor. However, since the gate of the drive transistor and the gate of the load transistor are a structure in which the gates are shared by a common polysilicon gate as shown in FIG. 8, a PN boundary portion exists within the polysilicon gate electrode.

[0090] 9 is a cross-sectional structure diagram of a driving transistor sharing a...

Embodiment 3

[0140] A method of suppressing variations in characteristics of transistors has been described in the above-described embodiments in conjunction with microfabrication. In general, it is difficult to ensure write and read margins of SRAM memory cells according to microfabrication.

[0141] In Embodiment 3, a method for ensuring write and read margins of SRAM memory cells is described.

[0142] FIG. 15 is a schematic diagram of a word line driver WDV and an auxiliary circuit PD according to Embodiment 3 of the present invention.

[0143] Referring to FIG. 15, the word line driver WDV includes an inverter 10 that receives a word line selection signal WS from the row decoder 2, and a CMOS inverter that inverts the output signal of the inverter 10 and drives the word line WL. P-channel MOS transistors PQ15 and NQ15.

[0144] When the word line WL is selected, the word line selection signal WS is H level, the inverter 10 responds, and its output signal constitutes an L level, and ...

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Abstract

The semiconductor memory device which can suppress that the characteristics variation of a transistor increases in connection with microfabrication is offered. In the memory cell of the present invention, channel width of an access transistor is made larger than the channel width of a driver transistor about the relation of the channel width of an access transistor and a driver transistor. That is, since the access transistor can make channel area increase from the driver transistor designed with the minimum designed size, it becomes possible to suppress the increase in the characteristics variation of an access transistor.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Japanese Patent Application No. 2006-221906 filed on Aug. 16, 2006, the contents of which are hereby incorporated by reference into this application. technical field [0003] The present invention relates to the layout of a CMOS type SRAM memory cell in a semiconductor memory device. Background technique [0004] In recent years, with the spread of portable terminal equipment, the importance of digital signal processing for processing a large amount of data such as sound and images at high speed is increasing. As a semiconductor memory device mounted in such portable terminal equipment, SRAM with high-speed access processing capability occupies an important position. [0005] Especially in recent years, there has been a tendency to make the bit capacity of the SRAM larger as the size of the system mounted on the semiconductor chip becomes larger. In order to meet the demand on s...

Claims

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Application Information

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IPC IPC(8): H01L27/11
CPCH01L27/1104H01L29/7833G11C11/412H01L27/11H10B10/00H10B10/12
Inventor 五十岚元繁坪井信生岩崎敏文新居浩二塚本康正
Owner RENESAS TECH CORP
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