44 results about "Stress minimization" patented technology

Improved flow cytometer system particularly adapted to use for sex-selected sperm sorting include enhanced sheath fluid and other strategies which minimize stress on the sperm cells, including a 2.9 percent sodium citrate sheath solution for bovine species and a hepes bovine gamete media for equine species. Improved collection systems and techniques for the process are described so that commercial applications of sperms samples as well as the resulting animals may be achieved.

A pressure support system and method of treating disordered breathing that optimizes the pressure delivered to the patient to treat the disordered breathing while minimizing the delivered pressure for patient comfort. The controller in the pressure support system operates as a set of prioritized control layers, wherein each control layer competes for control of the pressure generating system to implement a unique pressure control process. The pressure support system also controls the pressure provided to the patient based on the variability of the monitored data and a trend analysis of this data, including an indication the skewness of the patient's inspiratory waveform.

A pressure support system and method of treating disordered breathing that optimizes the pressure delivered to the patient to treat the disordered breathing while minimizing the delivered pressure for patient comfort. The controller in the pressure support system operates as a set of prioritized control layers, wherein each control layer competes for control of the pressure generating system to implement a unique pressure control process. The pressure support system also controls the pressure provided to the patient based on the variability of the monitored data and a trend analysis of this data, including an indication of the skewness of the patient's inspiratory waveform.

Improved flow cytometer system particularly adapted to use for sex-selected sperm sorting include enhanced sheath fluid and other strategies which minimize stress on the sperm cells, including a 2.9 percent sodium citrate sheath solution for bovine species and a hepes bovine gamete media for equine species. Improved collection systems and techniques for the process are described so that commercial applications of sperms samples as well as the resulting animals may be achieved.

The invention is related in general to wellbore-telemetry technology. In particular, the invention relates to improved equipment and methods for deploying line in a wellbore. A continuous line is dispensed from two apparatuses. One apparatus is attached to a device such as a wiper plug that travels through a tubular body such as casing. The other apparatus is fixed either inside or outside a wellhead. As a process fluid is pumped into the tubular body, forcing the first apparatus and the device through the tubular body, line may unfurl from the first apparatus, the second apparatus, or both. In this way, stress on the line during deployment is minimized.

One aspect of the invention pertains to a semiconductor die with rounded sidewall junction edge corners. Such rounding reduces stress accumulations at those corners. In other embodiments of the invention, the sharpness of other corners and edges in the die are reduced. For example, reducing the sharpness of the bottom edge corners formed by the intersection of a sidewall and the back surface of a die can further diminish stress accumulations. One embodiment pertains to a wafer carried on a wafer support, where the wafer includes a multiplicity of such dice. Another embodiment involves a semiconductor package containing such dice. Methods of fabricating the dice are also described.

A method is provided for bonding a semiconductor chip to a packaging substrate while minimizing the variation in the solder ball heights and controlling the stress in the solder balls and the stress in the packaging substrate. During the solder reflow, the warp of the packaging substrate, including the absolute warp, thermal warp, and substrate to substrate variations of the warp, is constrained at a minimal level by providing a clamping constraint to the packaging substrate. During cool down of the solder balls, the stresses and strains of the solder joints are maintained at levels that do not cause tear of the solder joints or breakage of the packaging substrate by removing the clamping constraint. Thus, the bonding process provides both uniform solder height with minimized solder non-wets and stress minimization of the solder balls and the packaging substrate.

A method and system for drawing directed graphs including receiving data coordinates associated with nodes for graphing, performing a constrained stress minimization, and outputting results of the constrained stress minimization and displaying the results on a visual medium. The described method may take the form of instructions residing on a computer readable medium. The described method and system may be utilized for drawing directed graphs in a very wide range of applications ranging from gene networks, to flowcharts, to display of relational characteristics of breakfast cereal and so on.

The invention discloses a three-dimensional printed object structure optimizing algorithm based on stress analysis. The algorithm comprises steps as follows: a three-dimensional network model of a printed object is acquired, and a user sets force distribution and printed material size constraints; printing parameters of the three-dimensional model are optimized automatically, a heterogeneous frame structure is generated automatically through input by the user, and initial parameters are determined and optimized; a solid model is generated according to optimized printing parameters; three-dimensional printing is performed on the generated solid model, and a three-dimensional printing model is established with physical properties of a printed material, printing conditions and material sizes of the printed object used as constraints and stress minimization of the printing model used as the target. With the adoption of the algorithm, adaptive optimization of the scaling ratio and the number in a frame can be realized, the strength requirement for the object is guaranteed under the condition that the regulated material size is used, and besides, the model can be simplified; the strength of the printed object is improved through parameter optimization and the topology structure of the object is simplified.

A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

A medical device for anchoring itself and other medical devices while channeling blood flow through the center of a vessel proximal to the device's target area to minimize debris and the pressure necessary to move blood proximal to the device. The medical device also provides superior recoil reduction capabilities. A doughnut-shaped balloon that may be inflated and deflated by increasing and decreasing pressure within the balloon, having two passages therethrough, dimensioned for blood flow and a delivery device. A method for using the device.

A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

A method is provided for bonding a semiconductor chip to a packaging substrate while minimizing the variation in the solder ball heights and controlling the stress in the solder balls and the stress in the packaging substrate. During the solder reflow, the warp of the packaging substrate, including the absolute warp, thermal warp, and substrate to substrate variations of the warp, is constrained at a minimal level by providing a clamping constraint to the packaging substrate. During cool down of the solder balls, the stresses and strains of the solder joints are maintained at levels that do not cause tear of the solder joints or breakage of the packaging substrate by removing the clamping constraint. Thus, the bonding process provides both uniform solder height with minimized solder non-wets and stress minimization of the solder balls and the packaging substrate.

A battery jumper for a battery having a battery terminal at a terminal side edge thereof includes a battery station, a recharging circuit, and a resilient unit. The battery station has a battery shoe adapted for coupling the terminal side edge of the battery to retain the battery in position. The recharging circuit includes a power inlet adapted for electrically connecting with a power source, and a charging terminal supported at the battery shoe for contacting with the battery terminal of the battery to recharge the battery. The resilient unit is supported at the battery shoe for applying a pushing force against the terminal side edge of the battery to minimize a pressure of the charging terminal against the battery terminal of the battery.

The present invention is a medical device for anchoring itself and other medical devices while channeling blood flow through the center of a vessel proximal to the device's target area to minimize debris and the pressure necessary to move blood proximal to the device of the present invention. It also provides superior recoil reduction capabilities. Disclosed is a bulging torus or doughnut-shaped balloon medical device that may be inflated and deflated by increasing and decreasing pressure within the balloon, having two passages therethrough, dimensioned for blood flow and a delivery device. A method using the device is also disclosed.

A method for preparing esters of cyclohexane polycarboxylic acids from esters of benzene polycarboxylic acids makes improvement to hydrogenation of esters of benzene polycarboxylic acids by using a reaction tank having a gas-introducing mixer capable of extracting and exhausting air and stirring to hydrogenate an ester of a benzene polycarboxylic acids into an ester of a cyclohexane polycarboxylic acid in the presence of a hydrogenation catalyst; resulted in that the method advantageously minimizes the operational pressure for hydrogenating esters of benzene polycarboxylic acids and significantly lowers the reaction temperature for hydrogenation while effectively improving the yield of esters of cyclohexane polycarboxylic acids made from the esters of the benzene polycarboxylic acids.

A body support such as a mattress is provided formed of a top layer, an intermediate layer and a base layer. Optional side supports are also provided. Each of these layers and optional side supports are formed of different polyurethane and / or latex foam compositions. Maximum and average peak pressures are minimized by having the intermediate layer of the mattress or other body support be formed of high resilience foam, such as foam with between forty-five and sixty-five percent resilience factor. This intermediate layer is also provided with a greater density than typical prior art body supports, with a density of between 2.5 and 3.5 pounds per cubic foot.

The invention provides a sewage and wastewater treatment device based on cyclic biological treatment and belongs to the technical field of wastewater treatment devices. According to the sewage and wastewater treatment device, oil components difficult to decompose generated during sewage treatment are separated in advance in a flow regulating tank, the reproduction of denitrifying microorganisms is induced according to soil activation combined with a first CBT reaction tank, and meanwhile, the soil containing excessive phosphorus is conveyed at the bubbling stage of a second CBT reaction tank, and therefore, nitrogen and phosphorus also can be removed evenly in an environment in which the ratio of organic matters to nitrogen in sewage or wastewater is relatively low. The first CBT reaction tank is differentiated and mounted, the survival time and the activity time of the microorganisms are shortened by use of activated soil in the second CBT reaction tank, the hydraulic stay time is reduced, automatic operation can be realized under a bad air condition and a good air condition during air supply by use of a tube diffuser connected with a vortex wheel pump, the organic matters and the phosphorus are removed to prevent sludge expansion, and the pressure caused by the microorganisms is minimized.

The present invention relates to a method for manufacturing a metal scrap compression material. According to the method for manufacturing the metal scrap compression material, a through-hole is not punched after compressing the metal scrap compression material, but rather a through-hole is formed during the process of manufacturing the metal scrap compression material. Thus, even though the through-hole is formed in the metal scrap compression material which is compressed and formed so as to be highly dense, friction and stress applied to a core may be minimized to minimize the damage of the core and a failure occurrence rate.

The invention relates to a check valve for a small sized hot-water boiler capable of preventing noise. A left inner tube and a left outer tube are arranged around the left outside of a cylindrical body as a double layer surrounding structure with a certain interval. The water of water tank passes between the outer surface of the left inner tube and the inner surface of the left outer tube, and circulates like a ''z'' character between the inner surface of the left inner tube and the outer surface of the check valve cylindrical body. A right inner tube and a right outer tube are arranged around the right side of the cylindrical body as a double layer surrounding structure with a certain interval. The fast expand hot water which is heated by a heater cylinder passes between the outer surface of an inward tube connection opening in the right outer tube center and the inner surface of the right inner tube, and circulates like a ''z'' character between the outer surface of the right inner tube and the inner surface of the cylindrical body, thereby minimizing the circulation pressure of the water from the water tank and the hot water from the heater heater cylinder and forming a double water layers, and preventing the opening and closing noise in the check valve from speading outward.

The invention discloses a temperature and pressure integrated MEMS sensor packaging process, which comprises the following steps: (1) silicon microbead mixed fixing glue is dripped on a PCB through a die bonder, and the silicon microbead mixed fixing glue is formed by uniformly mixing elastic microbeads and silica gel, the bottom of the conditioning circuit chip is attached to the upper portion of the silicon bead mixed fixing glue through a suction method and pressed on the PCB, and the temperature compensation MEMS pressure chip is attached to the conditioning circuit chip through the same method; (2) high-temperature curing; (3) carrying out wire connection by a gold wire bonding technology; (4) coating glue for fixing the metal protection body; (5) installing a metal protection body; (6) baking at high temperature to form a semi-packaged product; and (7) soft waterproof glue is injected. According to the invention, the silicon sensor substrate and the bottom support can be effectively isolated, and uniform isolation height and elastic bonding are realized, so that the stress minimization of the sensor is achieved, and the authenticity of the original output of the MEMS pressure sensor is kept.

Bicycle saddles come in many different shapes and sizes. Some are long, some are short, some are curved some are flat. The ultimate goal is to find the perfect saddle for the cyclist.CLARIFICATION: those that ride bicycles are commonly referred to as cyclists, bikers, cyclists, bicycle cyclists, bicyclists, cycle cyclists, cycling, etc., but for this discussion, they will be referred to as ‘cyclist(s)’As with the height of humans, the widths of Ischial Tuberosities (Sit Bones) are also numerous. The Ischial Tuberosities are the protruding bones of the hip / pelvis that sit underneath the muscles of the glute and is the part of the body that first contacts the saddle. Everyone has a different width and the importance for a cyclist in finding the exact width is critical for long-term health and cycling enjoyment.Excessive weight / pressure on the soft tissue can lead to health issues such as tumors, genital numbness and even erectile dysfunction due to Pudendal nerve compression and or crushing and or blocking of the Pudendal artery.SADDLE DESIGN—The rear area of a saddle is where the Ischial Tuberosities should rest. This area of the saddle comes in one of two shapes, either (a) flat, or (b) curved. This is where the cyclist should apply most of their weight. The most important item is for the cyclist to minimize the amount of pressure to their soft tissue, in other words, the correct saddle width and saddle shape is paramount in preventing as much of the cyclists' soft tissue from coming into contact with the saddle. Ideally, the majority of contact with the saddle will come from contact of the cyclists' Ischial Tuberosity, the Ischial Ramus and Inferior Ramus of Pubis.This Ischial Tuberosity measuring tool can measure any / all types of cyclists and can be used to measure any / all saddles where a saddle(s) that the bicycle shop carries can be recommended to the cyclist. It is important to note that the recommended saddle(s) will be the correct fitting saddle(s) for the cyclist.This saddle fit system is comprised of impression foam pad(s) that are attached to an organic or inorganic substrate that supports the cyclists weight. Also included are 2 ferrous, non-ferrous or non-metallic balls as well as a detached Vernier caliper measuring device.The cyclist sits and centers themselves on the saddle fit system. The bike fitter then has the cyclist stand thereby leaving 2 indentation impressions on the impression foam. The bike fitter then takes the 2 balls and drops one onto each side of the impression foam pad. Due to the natural force of gravity, these balls will self-center into the exact center-point of each Ischial Tuberosity impression left by the cyclist.The bike fitter will then take the supplied detached calipers and measure the distance from center-point of each ball. This dimension will be noted, shown and discussed with the customer who will then decide on a preferred saddle(s) shape and material.The bike fitter will then show the cyclist preferred saddles by laying the calipers over the top of each saddle and centering the tips of the caliper where the cyclists' Ischial Tuberosities will be contacting the saddle. A follow-on conversation regarding best-fit / best-usage of a recommended saddle based on (a) cyclists' flexibility, (b) cyclists' body shape and conditioning, (c) saddle width and (d) saddle shape can then be held with the cyclist.SIZING THE SADDLE—When the caliper is layed on top of the rear of the saddle, the drop from the Ischial Tuberosity to the top of the saddle can be easily seen and shown to the cyclist. In most cases, the difference between a flat saddle vs a curved saddle is one size difference where the curved saddle usually requires one size wider than the flat top saddle. This is important for a healthy perineum and the correct saddle sizing is easily shown with this tool. Too much of a drop between the ideal placement of the Ischial Tuberosity and contact with the saddle can cause an excessive amount of pressure to be applied to the cyclists' soft tissue.Cited Workshttp: / / www.ncbi.nlm.nih.gov / pubmed / 20102446 http: / / www.webmd.com / men / features / biking-and-erectile-dysfunction-a-real-riskhttps: / / www.researchgate.net / publication / 265514647_Cycling-Related_Sexual_Dysfunction_in_Men_and_Women_A_Reviewhttp: / / www.ncbi.nlm.nih.gov / pubmed / 16422816 http: / / www.ncbi.nlm.nih.gov / pubmed / 18042330 http: / / www.nchi.nlm.nih.gov / pubmed / 17227499 http: / / www.ncbi.nlm.nih.gov / pubmed / 16230994 http: / / www.ncbi.nlm.nih.gov / pubmed / 3809048 http: / / www.sellesmp.com / smp4bike / images / stories / pro2016-en / index.html

A hip abduction pillow is used to prevent to post operative hip dislocation of a patient that received a hip prosthesis. The hip abduction pillow may be integrally formed rigid foam or other suitable material and enables a single person to rotate the patient from side to side with virtually no risk of post operative hip dislocation while minimizing pressure on a patient's heels to virtually eliminate heel pressure sores. The hip abduction pillow includes a base portion; a support portion; and a spacer portion. The hip abduction pillow is self-supporting and can support the patient in two stable alternative rotated positions without the need for a pillow or other support material to maintain a patient in a rotated position.

Techniques of minimizing or eliminating stresses in silicon photonic integrated circuits (Si-PICs) and in semiconductor packages having one or more Si-PICs (Si-PIC packages) are described. An Si-PIC or an Si-PIC package includes a stress minimization solution that assists with filtering out stresses by selectively isolating photonic and / or electronic devices, by isolating components or devices in an Si-PIC or an Si-PIC package that are sources of stress, or by isolating an Si-PIC in an Si-PIC package. The stress minimization solution may include strategically placed cavities and a stage that assist with minimizing or preventing transfer of stress to one or more photonic and / or electronic devices in an Si-PIC or an Si-PIC package.

A device including a NEMS / MEMS machine(s) and associated electrical circuitry. The circuitry includes at least one transistor, preferably JFET, that is used to: (i) actuate the NEMS / MEMS machine; and / or (ii) receive feedback from the operation of the NEMS / MEMS machine The transistor (e.g., the JFET) and the NEMS / MEMS machine are monolithically integrated for enhanced signal transduction and signal processing. Monolithic integration is preferred to hybrid integration (e.g., integration using wire bonds, flip chip contact bonds or the like) due to reduce parasitics and mismatches. In one embodiment, the JFET is integrated directly into a MEMS machine, that is in the form of a SOI MEMS cantilever, to form an extra-tight integration between sensing and electronic integration. When a cantilever connected to the JFET is electrostatically actuated; its motion directly affects the current in the JFET through monolithically integrated conduction paths (e.g., traces, vias, etc.) In one embodiment, devices according to the present invention were realized in 2[mu]m thick SOI cross-wire beams, with a MoSi2 contact metallization for stress minimization and ohmic contact. In this embodiment, the pull-in voltage for the MEMS cantilever was 21V and the pinch-off voltage of the JFET was -19V.

Techniques of minimizing or eliminating stresses in silicon photonic integrated circuits (Si-PICs) and in semiconductor packages having one or more Si-PICs (Si-PIC packages) are described. An Si-PIC or an Si-PIC package includes a stress minimization solution that assists with filtering out stresses by selectively isolating photonic and / or electronic devices, by isolating components or devices in an Si-PIC or an Si-PIC package that are sources of stress, or by isolating an Si-PIC in an Si-PIC package. The stress minimization solution may include strategically placed cavities and a stage that assist with minimizing or preventing transfer of stress to one or more photonic and / or electronic devices in an Si-PIC or an Si-PIC package.

The invention provides a strong overload environment-oriented lens mounting structure optimal parameter design method. The method includes the following steps that: corresponding test indexes are determined according to the structural design requirements of an optical machine system and a deformation and stress minimization principle; lens mounting structural parameters are selected as test factors, the number of the levels of each of the factors is determined; an orthogonal table is selected, orthogonal test table header design is carried out, lens deformation and stress dynamics calculationunder a strong overload environment is performed; a range analysis method is adopted to perform statistic analysis on lens deformation and stress peak values, and an optimal level combination under asingle test index is determined; and a comprehensive balance method is used to analyze orthogonal test range analysis results under the single test index, so that an optimal level combination and thesequence of the primary and secondary test factors of the test factors under a plurality of test indicators are obtained. The method of the invention has the advantages of simple principle, high reliability, simple design and small calculation amount, and has great guiding significance for research on the anti-overload performance of the optical machine system.