Check patentability & draft patents in minutes with Patsnap Eureka AI!

Semiconductor package structure

A packaging structure and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems that the reliability of the bump packaging structure needs to be improved, and achieve saving process steps, increasing contact area, The effect of enhancing adhesion

Inactive Publication Date: 2013-12-25
NANTONG FUJITSU MICROELECTRONICS
View PDF5 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the reliability of the existing bump packaging structure still needs to be improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor package structure
  • Semiconductor package structure
  • Semiconductor package structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] After research, the bumps of the existing packaging structure are located on the surface of the metal layer under the bumps, and when subjected to external pressure or internal stress, the bumps are easy to fall off from the surface of the metal layer under the bumps or between the bumps and the bumps. The contact interface of the metal layer produces crack defects, which affects the reliability of the packaging structure.

[0023] The present invention provides a semiconductor packaging structure and a method for forming the same. The semiconductor packaging structure includes a polymer layer covering the semiconductor base and a part of the pad layer, and the polymer layer has a surface exposed to the pad layer. There are several discrete polymer pillars on the surface of the welding pad layer inside the opening; and a raised metal layer on the surface of the welding pad layer, polymer pillars and part of the polymer layer outside the opening. The presence of the poly...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A semiconductor package structure comprises a semiconductor substrate, a welding pad layer, a polymer layer and a convex metal layer. The semiconductor substrate and the welding pad layer are covered by the polymer layer, an opening where the surface of one part of the welding pad layer is exposed is formed in the polymer layer, a plurality of separated polymer columns are arranged on the surface of the welding pad layer in the opening, and the convex lower metal layer is arranged on the surface of one part of the polymer layer outside the welding pad layer, the polymer columns and the opening. The semiconductor package structure is higher in reliability.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor packaging structure. Background technique [0002] Today, with the rapid development of information technology, the market prospect of integrated circuits is getting wider and wider. Correspondingly, the industries of integrated circuit design, chip manufacturing and integrated circuit packaging are all developing rapidly. In my country, the IC packaging industry has become an important economic growth point of the IC industry. In order to meet the needs of high-speed processing, multi-function, integration, miniaturization and low price of integrated circuit components, integrated circuit packaging technology also needs to be developed towards miniaturization and high density. Currently commonly used IC packaging technologies include Ball Grid Array (BGA), Chip-Scale Package (CSP) and Multi-Chip Module (MCM). In the packaging technology of integrated ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/31
CPCH01L2224/0401H01L2224/05558H01L2224/13082
Inventor 林仲珉陶玉娟
Owner NANTONG FUJITSU MICROELECTRONICS
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com