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LED packaging structure and manufacture method thereof

A light-emitting diode and packaging structure technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems that the manufacturing cost of the light-emitting diode module cannot be reduced, and the cost of the circuit substrate cannot be effectively reduced.

Inactive Publication Date: 2013-12-25
LIGHT OCEAN TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the circuit substrate includes a circuit layer, the cost of the circuit substrate cannot be effectively reduced, resulting in the inability to reduce the manufacturing cost of the LED module

Method used

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  • LED packaging structure and manufacture method thereof
  • LED packaging structure and manufacture method thereof
  • LED packaging structure and manufacture method thereof

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Experimental program
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Embodiment Construction

[0021] Please refer to Figure 1a , which is a side view showing an LED packaging structure according to an embodiment of the present invention, including a blank substrate 1 , a plurality of LED dies 2 , a plurality of wires 4 , a first encapsulant 5 and a second encapsulant 6 . Here, the blank substrate 1 refers to the surface of the substrate or there is no circuit layer or interconnection structure inside it, but only has a larger area of ​​conductive contacts, such as the second electrode 12 of the first electrode 11 electrically connected to the outside. . There is no restriction on the shape and material of the blank substrate 1 , the common shape of the blank substrate 1 is square, but not limited thereto. Common materials of the blank substrate 1 may include but not limited to copper foil substrates, glass fiber substrates, ceramic substrates or polymer material substrates. In addition, in an embodiment, the blank substrate 1 may also refer to a general carrier witho...

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PUM

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Abstract

An LED packaging structure includes a blank substrate, a plurality of LED grains and a plurality of lead wires. The blank substrate has a first electrode and a second electrode. The LED grains are arranged on the blank substrate, an LED grain is electrically connected with another LED grain and one of the first electrode and the second electrode through a lead wire. According to the LED packaging structure, the LED grains are arranged on the blank substrate without circuit layer, thereby process is reduced, manufacture costs are decreased, etc. In addition, the invention also discloses a packaging method of LED modules.

Description

technical field [0001] The invention relates to a light-emitting diode packaging structure and a manufacturing method thereof, in particular to a light-emitting diode packaging structure in which light-emitting diode crystal grains are arranged on a blank substrate and a manufacturing method thereof. Background technique [0002] Due to the characteristics of low power consumption and long life, light emitting diodes have been widely used in various products, such as traffic lights, indicator lights, lighting tubes, backlight modules of liquid crystal displays, etc. [0003] A known LED module includes a circuit substrate and a plurality of LED components. The surface of the circuit substrate includes a circuit layer, and the plurality of LED components are disposed on the circuit substrate. The LED assembly is electrically connected to the circuit layer on the circuit substrate through the subsequent wire bonding process, and the LED assembly is covered with glue in the glu...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L33/00
CPCH01L2224/8592H01L2224/48137
Inventor 荘永富
Owner LIGHT OCEAN TECH CORP