Data collection implementation method of semiconductor manufacturing equipment

A technology for data collection and manufacturing equipment, applied in the direction of electrical components, transmission systems, etc., can solve the lack of a secure communication mechanism for SECS/GEM communication, communication security cannot be guaranteed, and SECS/GEM communication methods cannot meet the needs of equipment and user data collection and other issues to achieve the effect of improving equipment data collection capabilities and ensuring safety

Inactive Publication Date: 2014-01-01
SHENYANG INST OF AUTOMATION - CHINESE ACAD OF SCI
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the data collection of semiconductor equipment mainly relies on the SECS / GEM communication method, but as 300mm wafer processing becomes the mainstream, the SECS / GEM communication method cannot meet the needs of current equipment and user data collection
SECS / GEM communication lacks a secure communication mechanism and cannot guarantee communication security; it can only support one user for data collection; it only has the self-description function of some devices, and the obtained device data is very little and of low quality

Method used

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  • Data collection implementation method of semiconductor manufacturing equipment
  • Data collection implementation method of semiconductor manufacturing equipment
  • Data collection implementation method of semiconductor manufacturing equipment

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Embodiment Construction

[0038] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0039] The present invention is oriented to the data collection realization method of semiconductor manufacturing equipment and comprises the following steps:

[0040] 1) figure 1 Flowchart for data collection. The data collection steps are: establish a Web service on the device side and the client side, and use the proxy class to realize the service connection, realize the call to the interface service provided by the device side; call the device authentication interface, and the client side and the device side use the secure socket layer protocol Client security authentication, exchange information with each other, and create SOAPHeader data messages to ensure the security of data communication between the device and the client; the client defines and sends a data collection plan based on the information it cares about the device for use in...

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Abstract

The invention relates to a data collection implementation method of semiconductor manufacturing equipment. The data collection implementation method comprises the steps: respectively building a Web service at a client terminal and an equipment server terminal, enabling a proxy class to be used in Web communication, conducting client safety certification based on a security socket layer, defining a SOAPHeader data format, building an equipment information database, using an agent entrustment mode to process various abnormal events in the equipment, building a state machine of a data collection plan, achieving behavior conversion on the data collection plan, and using a COM assembly to complete connection between the equipment terminal and an equipment control system. According to the data collection implementation method, a general equipment data collection method is provided for semiconductor manufacturing, and the data collection capacity between a producer and the equipment in a plant in semiconductor production and manufacturing is improved.

Description

technical field [0001] The invention belongs to semiconductor equipment communication technology, in particular to a method for realizing data collection for semiconductor manufacturing equipment. Background technique [0002] As the production of semiconductor integrated circuits develops towards the production of 300mm wafers, the data demand for semiconductor manufacturing equipment increases sharply, and the equipment is further required to support a series of "Equipment Engineering Capabilities", such as E- Diagnosis, data acquisition, recipe management, fault detection and classification, Run-To-Run control and other upper-level applications. The most important factor to realize these applications is to obtain various device data. Therefore, more and higher-quality data are urgently needed to support accurate manufacturing of equipment and optimize factory automation. [0003] At present, the data collection of semiconductor equipment mainly relies on the SECS / GEM co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04L29/06H04L29/08
Inventor 刘明哲徐皑冬叶家发王亚楠
Owner SHENYANG INST OF AUTOMATION - CHINESE ACAD OF SCI
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