Preparation method of tensile sample of electron beam physical vapor deposition (EB-PVD) panel

Abstract

The invention relates to a preparation method of a tensile sample of an electron beam physical vapor deposition (EB-PVD) panel. The preparation method comprises the steps of polishing the bottom surface, which is used for depositing a panel, of the substrate, wherein graphite is taken as the substrate; processing an included angle between the bottom surface of the substrate and the surrounding side wall surface into an acute angle; and preparing a deposited material layer on the bottom surface by EB-PVD. According to the preparation method of the tensile sample of the EB-PVD panel, the deposition sample and the substrate can be easily separated to obtain the panel sample prepared by the EB-PVD, and then the tensile property of the panel sample is tested; meanwhile, the tensile sample can be formed once, and thus the subsequent shape processing procedure of the tensile sample is omitted.

Description

technical field [0001] The invention relates to a method for preparing a tensile sample, in particular to a method for preparing a tensile sample of an electron beam physical vapor deposition plate. Background technique [0002] Electron beam physical vapor deposition (EB-PVD, electron beam physical vapor deposition) is in a certain vacuum atmosphere, using high-energy electron beams to bombard the evaporated material to melt, boil and even evaporate, and its vapor particles are finally deposited on the substrate or parts , stacking, condensing into a coating or material process. Using this process, a certain coating can be prepared on the surface of a part or material, and a new type of material can also be prepared. Electron beam physical vapor deposition material preparation is one of the effective technical approaches for the manufacture of modern new materials, which can prepare materials or components with various elements and their different distributions. However, ...

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Problems solved by technology

However, this release agent substance has a great influence on the initial interface of the deposited material, because the release agent particles are too large to cause large defects on the initial interface of the deposited plate, which affects the performance of the deposited material, and in the deposition process, with With the thickening of the deposition material (for example: the thickness is greater than 0.3mm), the deposition plate tends to detach by itself, and the thickness requirement cannot be met

like Figure 7 As shown, if a release agent is not used, because the bonding strength between the deposition layer 92 and the metal substrate 91 is very high, it is difficult to separate the deposition material from the substrate, and it is impossible to obtain a sample of the deposition material and perform related performance tests.

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