A kind of surface treatment copper foil and preparation method thereof

Abstract

The invention discloses a surface-treated copper foil and a preparation method thereof, which belong to the field of copper foil materials. The surface-treated copper foil is characterized by being formed by an untreated copper foil layer, a zinc-nickel alloy barrier layer, a tin-zinc alloy passivation layer and a porous structure armoring layer, and an organic layer can be immersed and sprayed on the surface of the surface-treated copper foil; the surface of a copper foil substrate can be subjected to electric net treatment, washing, activating treatment, washing, anti-diffusion barrier layer brush electroplating treatment, washing, anti-oxidation passivation layer brush electroplating treatment, washing, armoring layer de-alloying treatment, washing, organic layer treatment and drying in the end. The surface-treated copper foil disclosed by the invention has the advantages that an armoring layer and a solidification layer of a traditional surface-treated copper foil are eliminated, the resource is saved, the copper foil thickness is reduced, the cost of the surface-treated copper foil is reduced, the specific surface area of the surface-treated copper foil is enlarged due to a porous structure of a surface layer, the bonding strength between the surface-treated copper foil and a resin substrate is enhanced, the preparation process is short, the device is simple and environment-friendly, and the quality and the performance of the surface-treated copper foil are high.

Description

technical field

[0001] The invention relates to the field of copper foil materials, and in particular provides a surface-treated copper foil and a preparation method thereof. technical background

[0002] Copper foil (including rolled copper foil and electrolytic copper foil) is one of the core basic materials for the manufacture of printed circuit boards (Printed Circuit Board, PCB). With the rapid development of the electronic information industry, the use of copper foil is increasing, and the demand for high-performance copper foil is increasing. In practical applications, copper foil and resin substrate are generally pressed into copper clad laminates under high temperature and pressure conditions. In order to ensure sufficient bonding strength between the copper foil and the resin substrate, and prevent the diffusion of copper elements to the resin substrate during high temperature lamination, as well as oxidative discoloration, side corrosion, copper powder falling of...

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