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Silicon briquette cutting method and device

A cutting method and cutting device technology, which are applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of easy generation of fragments, cracks, gaps, etc., to improve stability, stabilize wire mesh, and reduce shaking. Effect

Inactive Publication Date: 2014-01-22
JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the cutting process, due to the shaking of the steel wire, it is easy to cause damage to the surface of the silicon wafer, resulting in edge chipping, gaps, hidden cracks, slivers, etc. prone to debris

Method used

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  • Silicon briquette cutting method and device
  • Silicon briquette cutting method and device
  • Silicon briquette cutting method and device

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Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0027] see figure 1 , a method for cutting a silicon block according to the first embodiment of the present invention. The method includes the following steps:

[0028] Step 101: Place the silicon block on the glass plate. In this embodiment, the length of the silicon block is 480 mm, the width is 150 mm, and the height is 156 mm, and the length of the glass plate is 480 mm, the width is 165 mm, and the thickness is 5 mm. Of course, in other embodiments, the silicon block and the glass plate may also have other external dimensions. Specifically, glue is applied to the bottom surface of the silicon block. The bottom surface coated with glue is placed on the glass plate in the center, and the length direction of the silicon block is consistent with the length direct...

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Abstract

A silicon briquette cutting method includes: placing a silicon briquette on a glass plate; adhering a first hard board to the wire feed side of the silicon briquette, setting the first preset height of the first hard board to be not smaller than the height of the silicon briquette, and setting the first preset length of the first hard board to be not smaller than the length of the silicon briquette; using a wire net formed by cutting wires to cut the silicon briquette into multiple silicon wafers. The invention further provides a silicon briquette cutting device used by the cutting method. By the cutting method and device, silicon wafer cutting point hidden crack, crack and notch proportion during silicon briquette cutting is reduced, cutting yield is increased, TTV value of the silicon wafer is reduced, and silicon loss is reduced.

Description

technical field [0001] The invention relates to the field of silicon block processing technology, in particular to a silicon block cutting method and a cutting device thereof. Background technique [0002] The core of modern silicon block cutting is that the cutting wire mesh completes the cutting action with the cooperation of the abrasive slurry. Up to 1000 cutting lines are wound parallel to each other on the wire wheel to form a horizontal "web" of cutting lines. The motor drives the wire pulley to move the entire cutting wire web at a speed of 5 to 25 meters per second. The speed of the cutting line, linear movement or back and forth movement is adjusted throughout the cutting process according to the shape of the ingot. During the movement of the cutting line, the nozzle will continuously spray the abrasive slurry containing suspended silicon carbide particles to the cutting line. Silicon blocks are fixed on the cutting table, usually 4 blocks at a time. The cuttin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
Inventor 李建彭也庆章金兵
Owner JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD
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