Nano-grade heat-insulation composite plate
A nano heat insulation and composite board technology, applied in the field of heat insulation materials, can solve the problems of high thermal conductivity and unsatisfactory heat insulation performance, and achieve the effect of low cost, simple production and easy acquisition
Inactive Publication Date: 2014-02-05
QINGDAO HI TECH PATENT TECH TRANSFER PLATFORM
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AI Technical Summary
Problems solved by technology
[0002] Existing high-temperature insulation boards generally use glass wool, rock wool, ceramic fiber, etc. as insulation materials. Due to the high thermal conductivity of glass wool, rock wool, ceramic fiber, etc. performance
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment 1
[0008] The nano heat insulation composite board of the present invention comprises the following components, 50 parts of nano silicon dioxide powder, 40 parts of nano zirconia powder, 20 parts of ethyl acetate, ethyl cellosolve, 50 parts of solvent, 12 parts of butanol 2 parts, 2 parts ethyl butyl ester, 5 parts silicone oil.
Embodiment 2
[0010] The nano heat insulation composite board of the present invention comprises the following components, 50 parts of nano silicon dioxide powder, 40 parts of nano zirconia powder, 20 parts of ethyl acetate, ethyl cellosolve, 50 parts of solvent, 12 parts of butanol Parts, 2 parts of ethyl butyl ester, 5 parts of silicone oil, 10 parts of sodium tripolyphosphate.
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The invention provides a nano-grade heat-insulation composite plate comprising the components of: 50 parts of nano-grade silica powder, 40 parts of nano-grade zirconium dioxide powder, 20 parts of ethyl acetate, 50 parts of a solvent ethyl cello-solvent, 12 parts of butanol, 2 parts of butyl acrylate, 5 parts of silicone oil, and 10 parts of sodium tripolyphosphate. The nano-grade composite heat-insulation material provided by the invention has the advantages of easy-to-obtain raw materials, simple production, and low cost. The plate can be widely applied in energy-saving fields such as high-temperature heat insulation, low-temperature heat insulation, and the like.
Description
technical field [0001] The invention relates to a heat insulation material, in particular to a nano heat insulation composite board. Background technique [0002] Existing high-temperature insulation boards generally use glass wool, rock wool, ceramic fiber, etc. as insulation materials. Due to the high thermal conductivity of glass wool, rock wool, ceramic fiber, etc. performance. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a thermal insulation material with high thermal insulation and energy saving efficiency, low thermal conductivity and low cost. [0004] In order to solve the above-mentioned technical problems, the nano heat-insulating composite board of the present invention comprises the following components, 50 parts of nano-silica powder, 40 parts of nano-zirconia powder, 20 parts of ethyl acetate, ethyl cellosolve, solvent 50 parts, 12 parts of butanol, 2 parts of ethyl butyl ester, 5 part...
Claims
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Inventor 魏书元
Owner QINGDAO HI TECH PATENT TECH TRANSFER PLATFORM