Back sheet for solar cell module and solar cell module including same
A solar cell and backplane technology, applied in applications, circuits, electronic equipment, etc., can solve problems such as poor moisture resistance, expensive, insufficient adhesion, etc., and achieve low-cost effects
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Embodiment 1
[0077] 10 parts by weight of titanium dioxide (TiO2) with an average particle size of 3 μm 2 ) mixed with 100 parts by weight of polyethylene (PE). The mixture was prepared into a 150 μm thick white PE film (hereinafter, referred to as “W-PE film”) by biaxial stretching.
[0078] Further, a 15 μm thick fluorine coating was formed by coating polytetrafluoroethylene (PTFE) on one surface of a heat-resistant PET film (thickness: 150 μm). On the other surface, the above-prepared W-PE film (PE+TiO 2 ) to prepare a backsheet with W-PE (150 μm) / heat-resistant PET (150 μm) / fluorine coating (15 μm) stacked structure.
Embodiment 2 to Embodiment 4
[0080] 10 parts by weight of titanium dioxide (TiO2) with an average particle size of 3 μm 2 ) mixed with 100 parts by weight of polyethylene (PE). The mixture was prepared into a 150 μm thick white PE film (W-PE film) by biaxial stretching.
[0081] In addition, a silicon dioxide layer of 30 nm, 120 nm, or 200 nm thick was formed by deposition on the lower surface of a heat-resistant PET film (thickness: 150 μm), and polytetrafluoroethylene (PTFE) was coated on the lower surface of the silicon dioxide layer. A 15 µm thick fluorine coating was formed. On the upper surface of the heat-resistant PET, the above-prepared W-PE film (PE+TiO 2 ) to prepare a backsheet with a stacked structure of W-PE (150 μm) / heat-resistant PET (150 μm) / silicon dioxide layer / fluorine coating (15 μm). Embodiments 2 to 4 are the same in the stacked structure, and only differ in the thickness of the silicon dioxide layer: embodiment 2 (silicon dioxide layer thickness: 30nm), embodiment 3 (silicon dio...
Embodiment 5
[0083] A film with a stacked structure of fluorine coating (15 μm) / heat-resistant PET (250 μm) / fluorine coating (15 μm) was prepared by coating polytetrafluoroethylene (PTFE) on both surfaces of a heat-resistant PET film (thickness 250 μm). backplane.
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