Device and application method for depositing film on side wall of micro-channel plate by using pressure difference

Abstract

The invention discloses a device and an application method for depositing a film on a side wall of a micro-channel plate by using pressure difference. The device comprises a positive pressure chamber and a negative pressure chamber, wherein a communication channel is arranged between the positive pressure chamber and the negative pressure chamber; an air inlet and an air outlet are respectively formed in the positive pressure chamber and the negative pressure chamber; a support for fixing the micro-channel plate is arranged in the middle of the communication channel; a sol liquid is filled into the positive pressure chamber and the negative pressure chamber. According to the device and the application method, the pressure difference on two sides of the micro-channel plate is utilized to achieve flowing of the sol liquid of a film material to be deposited inside a micro-channel, and subsequently the sol adhered to the side wall of the micro-channel is subjected to high-temperature treatment so as to achieve deposition of the film onto the side wall of the micro-channel plate. The thickness of a single deposited film depends on the sol concentration and the pressure difference on two sides of the micro-channel plate. Due to adoption of the device and the application method, the difficult problem of orientation flowing of the sol liquid of the film material to be deposited inside the micro-channel of a small size is solved, and the deposition of the film material onto the side wall of the micro-channel plate is achieved.

Description

technical field [0001] The invention relates to a device and a method for depositing a film on the side wall of a microchannel plate by using a pressure difference, belonging to the field of micro-electromechanical systems. Background technique [0002] Due to its special structure, microchannel plates can be widely used in various fields such as photomultiplier, supercapacitor, lithium-ion battery, and gas sensor. In various applications, an important step is to deposit various functional materials on the sidewalls of microchannel plates. Existing technologies include chemical vapor deposition (CVD), atomic layer deposition (ALD), electroplating (Electroplating) and sol-gel (Sol-Gel). Both chemical vapor deposition and atomic layer deposition require relatively expensive machinery and equipment, and the cost is high; the electroplating method is powerless for some situations that require the deposition of functional materials on insulating substrates; the sol-gel method re...

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Problems solved by technology

Both chemical vapor deposition and atomic layer deposition require relatively expensive machinery and equipment, and the cost is high; the electroplating method is powerless for some situations that require the deposition of functional materials on insulating substrates; the sol-gel method requires the sol liquid to completely cover the substrate surface However, in the microchannel plate, the surface tension in the narrow channel has become the dominant factor, it is difficult for the sol liquid to completely cover the side wall surface through the narrow channel, and the air bubbles inside the microchannel will prevent the liquid from flowing in further. Therefore, how to make the It is difficult for the sol liquid to flow smoothly on the inner wall of the microchannel plate

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