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Clamp mechanism cushioning device

A buffer device and clip technology, which is applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of large impact force, lead frame clipping, chip damage, etc., to reduce impact force and safety. clamping effect

Inactive Publication Date: 2016-11-23
CETC BEIJING ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the large magnetic field force, the clamp has a great impact on the clamped lead frame. Excessive impact force will often cause the lead frame to be clamped or cause position shift due to vibration and damage to the chip.
Will seriously affect the accuracy and quality of the welding wire

Method used

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Experimental program
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Embodiment Construction

[0021] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0022] Aiming at the existing problem of clamping the lead frame, the invention provides a clamping mechanism buffer device.

[0023] Such as figure 1 , figure 2 As shown, the embodiment of the present invention provides a clip mechanism buffer device, which is applied to the clamping system of a wire bonding machine, including: a solenoid 2, used to provide the driving force of the clip mechanism buffer device; suction The plate 3 is used to drive the clip 1 and the damping sheet 5 to move according to the driving force provided by the solenoid 2; the damping sheet 5 is used to generate eddy current according to the movement driven by the suction plate 3; the clip 1 is used to clamp the lead wire frame.

[0024] Wherein, the clip 1 , the suction pie...

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PUM

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Abstract

The invention provides a buffering device for a piece clamping mechanism, and the buffering device is applied to a clamping system of a lead bonding machine. The buffering device comprises a solenoid, a suction plate, a damping fin and a clamp, wherein the solenoid is used for supplying drive force to the buffering device for the piece clamping mechanism, the suction plate is used for driving the clamp and the damping fin to move through the drive force supplied by the solenoid, the damping fin is used for being driven by the suction plate to move to produce a vortex, and the clamp is used for clamping a lead frame. According to the buffering device for the piece clamping mechanism, the impact produced when the lead frame is clamped can be reduced, and clamping can be carried out stably, precisely and safely.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a clip mechanism buffer device. Background technique [0002] The clamp mechanism buffer device is a new type of buffer device suitable for the clamping system of the semiconductor post-packaging equipment - wire bonder (Wirebonder). In the clamping system of the previous wire bonding machine, a solenoid is usually used to drive the suction plate for suction, and the suction plate directly drives the clamp to clamp the lead frame. When using this system to directly clamp the lead frame, the impact force is often very large, which will cause problems such as positional deviation of the lead frame, damage to the clamp, and damage to the chip. [0003] The electrical performance of semiconductor devices, such as integrated circuit chips, is generally achieved by bonding the chip to the lead frame, and then through wire bonding or flip-chip welding (connecting the chip pads to t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687
CPCH01L21/68707H01L2221/68363
Inventor 牛伟光柴亮李蒙
Owner CETC BEIJING ELECTRONICS EQUIP
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