A core of semiconductor energy superconductivity

Abstract

The invention relates to a semiconductor energy superconducting core, which includes an air multiplier jet module, an energy buffer module, a semiconductor thermocouple pair, a superconducting metal substrate, and a microchannel energy exchanger to form an integrated semiconductor thermoelectric module; A semiconductor energy superconducting core, one side of the two superconducting metal substrates is provided with multiple groups of micro-protrusions, the convex surfaces of the metal substrates are bonded together to form a closed micro-channel energy exchanger, and the two sides are provided with There is a liquid working fluid inlet and outlet; on the other side of the two superconducting metal substrates, there is an electrical circuit connection layer that matches the semiconductor thermocouple pair. The semiconductor thermocouple pair is arrayed on the electrical circuit connection layer and connected to the energy buffer module. One side of the electrical circuit connection layer forms a loop, and the other side of the energy buffer module is adapted to the air multiplier jet module; it can be seen that the present invention has fewer links, high energy conversion efficiency, compact structure, long working life, and low cost. features.

Description

technical field [0001] The invention relates to a semiconductor energy superconducting core, which is mainly used in industrial and civil air conditioners, construction machinery air conditioners, capillary heat exchange wall energy-saving invisible air conditioners, new air conditioner mattresses, etc., and belongs to the integrated application field of semiconductor heating and cooling. Background technique [0002] At present, the semiconductor thermoelectric module has the following shortcomings: the semiconductor thermoelectric module uses ceramics as the bonding substrate of the semiconductor thermocouple pair, and the microchannel energy exchanger uses a silicon base for photolithography and then bonding packaging or a metal substrate for CNC processing. ; The energy buffer module adopts ordinary aluminum profiles and fans, and the combination of each module is fixed and crimped with thermal conductive silicone grease and screws; There are disadvantages such as large ...

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Problems solved by technology

[0002] At present, the semiconductor thermoelectric module has the following shortcomings: the semiconductor thermoelectric module uses ceramics as the bonding substrate of the semiconductor thermocouple pair, and the microchannel energy exchanger uses a silicon base for photolithography and then bonding and packaging or uses a metal substrate for CNC processing. ; The energy buffer module uses ordinary aluminum profiles and fans, and the combination of each module is fixed and crimped with thermal conductive silicone grease and screws; Disadvantages such as large seam resistance, high system thermal resistance, large internal cooling leakage of the module, and high cost

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