An OLED display device packaging method and packaging structure

Abstract

The invention discloses a packaging method and packaging structure of an OLED display device. The packaging structure comprises a substrate, an OLED component placed on the surface of the substrate, an insulating blocking layer arranged on the surface of the cathode of the OLED component, unclosed cofferdam glue arranged on the edge of the substrate, a cover plate and padding glue. The substrate and the cover plate are bonded together by the unclosed cofferdam glue to form an OLED panel cavity with an opening, the padding glue is filled into the OLED panel cavity, so that the OLED panel cavity is full of the padding glue, and the OLED component is sealed. Water vapor and / or oxygen can be blocked by the padding glue and the cofferdam glue together, and thus the packaging structure of the OLED display device has a good water-oxygen blocking property. Meanwhile, based on the pressure difference principle, the packaging method can better overcome the defect of the padding glue on one hand, on the other hand, glue filling efficiency can be better improved, and the packaging efficiency of the OLED display device is improved.

Description

technical field [0001] The invention belongs to the field of OLED display technology, and in particular relates to a packaging method and a packaging structure of an OLED display device. Background technique [0002] Organic Light-Emitting Diode (OLED) has the characteristics of all solid state, active luminescence, high brightness, high contrast, ultra-thin and ultra-light, low power consumption, no viewing angle limitation, wide operating temperature range, etc., and is considered to be the next generation The core technology of the flat panel display. However, the electrodes and organic materials constituting the OLED elements of the OLED display device are extremely sensitive to external environmental factors such as oxygen and moisture. In actual use, the OLED display device needs to be packaged to isolate the OLED element from water and oxygen to prolong the life of the OLED display device. service life. [0003] The common packaging method of OLED display devices is...

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Problems solved by technology

[0003] The common packaging method of OLED display devices is to apply sealant on the edge of the cover plate and stick it to the substrate, and then cure the sealant to complete the package. Although this sealing method can provide good mechanical strength, it fails to give the panel Provide sufficient and reliable water and oxygen barrier performance; frit glass frit sealing has better sealing performance than sealant, and can maintain sealing performance within 7000h at 85°C and 85% relative humidity, but because glass is a brittle material, packaging Cracks are prone to occur during the process, and the technical difficulty is high; in addition, for the packaging of large-size OLED display devices, the substrate and cover are easily deformed by gravity and external force, and the deformed substrate and cover are easy to touch the OLED display device OLED The cathode of the component and cause damage to the OLED display device. Although this problem can be solved by the thin-film packaging method of alternate deposition of organic materials and inorganic materials, this packaging method is complicated in process and expensive in equipment, which is not convenient for popularization and application.

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