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Heat conductive coating

A technology of thermally conductive coatings and spherical fillers, applied in polyester coatings, epoxy resin coatings, polyurea/polyurethane coatings, etc., can solve problems such as poor thermal conductivity, reduce dosage, reduce production costs, and improve thermal conductivity.

Inactive Publication Date: 2014-03-12
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention solves the technical problem of poor heat conduction effect existing in the heat conduction paint existing in the prior art, and provides a new type of high heat conduction paint

Method used

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  • Heat conductive coating

Examples

Experimental program
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Effect test

Embodiment 1

[0024] Weigh raw materials according to the following ratio:

[0025] Solvent: (25wt% xylene, 15wt% butyl acetate and 12.95wt% ethylene glycol butyl ether) 52.95wt%

[0026] Auxiliary: Dispersant: BYK 110 0.5wt%

[0027] Leveling agent: TEGO Glide-410 0.25wt%

[0028] Defoamer: TEGO Foamex N 0.1wt%

[0029] Spherical filler: alumina (particle size 10μm) 15wt%

[0030] Aluminum oxide (particle size 4μm) 1wt%

[0031] Alumina (particle size 2μm) 0.2wt%

[0032] Main resin: one-component polyurethane resin 30wt%

[0033] According to the above ratio, the additives were first dispersed in the solvent, stirred for 5 minutes, then spherical fillers were added, stirred for 10 minutes, and finally the main resin was added, stirred for 30 minutes to obtain the thermally conductive coating S1 of this embodiment.

Embodiment 2

[0035] Weigh raw materials according to the following ratio:

[0036] Solvent: (23wt% xylene, 12wt% butyl acetate and 10.35wt% ethylene glycol butyl ether) 45.35wt%

[0037] Auxiliary: Dispersant: BYK 110 0.5wt%

[0038] Leveling agent: TEGO Glide-410 0.25wt%

[0039] Defoamer: TEGO Foamex N 0.1wt%

[0040] Spherical filler: alumina (particle size 10μm) 22wt%

[0041] Aluminum oxide (particle size 4μm) 1.4wt%

[0042] Alumina (particle size 2μm) 0.4wt%

[0043] Main resin: one-component polyurethane resin 30wt%

[0044] According to the above proportions, the auxiliary agent was first dispersed in the solvent, stirred for 5 minutes, then spherical filler was added, stirred for 10 minutes, and finally the main resin was added, stirred for 30 minutes to obtain the thermally conductive coating S2 of this embodiment.

Embodiment 3

[0046] Weigh raw materials according to the following ratio:

[0047] Solvent: (25wt% xylene, 15wt% butyl acetate and 12.95wt% ethylene glycol butyl ether) 52.95wt%

[0048] Auxiliary: Dispersant: BYK 110 0.5wt%

[0049] Leveling agent: TEGO Glide-410 0.25wt%

[0050] Defoamer: TEGO Foamex N 0.1wt%

[0051] Spherical filler: aluminum nitride (particle size 10μm) 15wt%

[0052] Aluminum nitride (particle size 4μm) 1wt%

[0053] Aluminum nitride (particle size 2μm) 0.2wt%

[0054] Main resin: one-component polyurethane resin 30wt%

[0055] According to the above ratio, the additives were first dispersed in the solvent, stirred for 5 minutes, then spherical fillers were added, stirred for 10 minutes, and finally the main resin was added, stirred for 30 minutes to obtain the thermally conductive coating S3 of this embodiment.

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Abstract

The invention provides a heat conductive coating. The heat conductive coating contains a main resin, a spherical filler and a solvent and may also comprises an assistant; and the spherical filler contains a first grade filler, a second grade filler and a third grade filler, wherein the average particle size D1 of the first grade filler is 8-12mum, the average particle size D2 of the second grade filler is not lower than 0.9*0.414D1 and is not greater than 0.414D1, and the average particle size D3 of the third grade filler is not lower than 0.8*0.225D1 and is not greater than 0.225D1. In the heat conductive coating, fillers having different particle sizes are adopted as a heat conductive medium in a coating, and the particle sizes of the fillers are optimized according to the Hosifeld hexagonal filling theory, that is, a compact and effective heat conductive pathway having a consistent direction to a hot fluid is formed in a paint film through a powder grading method by selecting fillers having specific particle sizes, so the heat conduction efficiency of the coating is substantially improved, and the consumption of the fillers are effectively reduced, thereby the production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of coatings, in particular to a heat-conducting coating. Background technique [0002] Nowadays, various electrical, electronic or mechanical devices contain many heat-generating components, such as light-emitting transistors, CPUs, batteries, and motors. With the advancement of technology, the volume of these components is constantly decreasing and the power is also increasing. However, as the power increases, its heat consumption also increases significantly. If a large amount of heat consumption cannot be dissipated in time, it will greatly affect the reliability of the equipment. According to statistics, among the factors that lead to the failure of electronic equipment, temperature accounts for about 55% (the remaining factors are 6% dust, 19% humidity, and 20% vibration). The failure rate increases exponentially. For some electronic devices, the failure rate will even more than double when the ambien...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D133/00C09D163/00C09D167/08C09D175/04C09D127/12C09D7/12C09D5/00
Inventor 徐炜于典崔静娜
Owner BYD CO LTD