Heat conductive coating
A technology of thermally conductive coatings and spherical fillers, applied in polyester coatings, epoxy resin coatings, polyurea/polyurethane coatings, etc., can solve problems such as poor thermal conductivity, reduce dosage, reduce production costs, and improve thermal conductivity.
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Embodiment 1
[0024] Weigh raw materials according to the following ratio:
[0025] Solvent: (25wt% xylene, 15wt% butyl acetate and 12.95wt% ethylene glycol butyl ether) 52.95wt%
[0026] Auxiliary: Dispersant: BYK 110 0.5wt%
[0027] Leveling agent: TEGO Glide-410 0.25wt%
[0028] Defoamer: TEGO Foamex N 0.1wt%
[0029] Spherical filler: alumina (particle size 10μm) 15wt%
[0030] Aluminum oxide (particle size 4μm) 1wt%
[0031] Alumina (particle size 2μm) 0.2wt%
[0032] Main resin: one-component polyurethane resin 30wt%
[0033] According to the above ratio, the additives were first dispersed in the solvent, stirred for 5 minutes, then spherical fillers were added, stirred for 10 minutes, and finally the main resin was added, stirred for 30 minutes to obtain the thermally conductive coating S1 of this embodiment.
Embodiment 2
[0035] Weigh raw materials according to the following ratio:
[0036] Solvent: (23wt% xylene, 12wt% butyl acetate and 10.35wt% ethylene glycol butyl ether) 45.35wt%
[0037] Auxiliary: Dispersant: BYK 110 0.5wt%
[0038] Leveling agent: TEGO Glide-410 0.25wt%
[0039] Defoamer: TEGO Foamex N 0.1wt%
[0040] Spherical filler: alumina (particle size 10μm) 22wt%
[0041] Aluminum oxide (particle size 4μm) 1.4wt%
[0042] Alumina (particle size 2μm) 0.4wt%
[0043] Main resin: one-component polyurethane resin 30wt%
[0044] According to the above proportions, the auxiliary agent was first dispersed in the solvent, stirred for 5 minutes, then spherical filler was added, stirred for 10 minutes, and finally the main resin was added, stirred for 30 minutes to obtain the thermally conductive coating S2 of this embodiment.
Embodiment 3
[0046] Weigh raw materials according to the following ratio:
[0047] Solvent: (25wt% xylene, 15wt% butyl acetate and 12.95wt% ethylene glycol butyl ether) 52.95wt%
[0048] Auxiliary: Dispersant: BYK 110 0.5wt%
[0049] Leveling agent: TEGO Glide-410 0.25wt%
[0050] Defoamer: TEGO Foamex N 0.1wt%
[0051] Spherical filler: aluminum nitride (particle size 10μm) 15wt%
[0052] Aluminum nitride (particle size 4μm) 1wt%
[0053] Aluminum nitride (particle size 2μm) 0.2wt%
[0054] Main resin: one-component polyurethane resin 30wt%
[0055] According to the above ratio, the additives were first dispersed in the solvent, stirred for 5 minutes, then spherical fillers were added, stirred for 10 minutes, and finally the main resin was added, stirred for 30 minutes to obtain the thermally conductive coating S3 of this embodiment.
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Abstract
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