Chip concurrent test system

Abstract

The invention discloses a chip concurrent test system comprising a module plate, and one area of the module plate is provided with a chip containing position; a bonding pad 1 is formed around the chip containing position; tested chips are placed on the chip containing position through a bonding method; the bonding pad 1and a bonding pad 2 are directly in bonding connection through a gold wire; a plurality of tested chips are placed on the chip containing position to form a chip array structure; the module plate is provided with a selector used for selecting the tested chips; a gold finger is used to add testing signals. The chip concurrent test system needs no probe card and probe bench, is wide in application range, simple in structure, and can improve test evaluation efficiency.

Description

technical field [0001] The invention relates to wafer testing of semiconductor integrated circuits, in particular to a chip simultaneous testing system. Background technique [0002] In the prior art, the wafer chip co-testing system must use the co-testing probe card. When developing and running the wafer testing system, especially the large-scale co-testing system, it is necessary to make a special co-testing probe card. , the wafer can only be tested after the same test probe card is confirmed to be correct. [0003] Similarly, in order to conduct large-scale wafer-level reliability testing and evaluation of new products, it is also necessary to use a high number of probe cards for simultaneous testing, but new products and existing mass-produced products have different process conditions. Therefore, the probe card of the new product is different from the probe card used in mass production, so in the prior art, it is necessary to make a new set of probe card for the same...

AI Technical Summary

Problems solved by technology

[0003] Similarly, in order to conduct large-scale wafer-level reliability testing and evaluation of new products, it is also necessary to use a high number of probe cards for simultaneous testing, but new products and existing mass-produced products have different process conditions. Therefore, the probe card of the new product is different from the probe card used in mass production, so in the prior art, it is necessary to make a new set of probe card for the same test for the new product, and the cost of this probe card is generally More expensive, so it will increase the cost of testing

Moreover, when the process of new products is different, the probe cards also need to be different, which further increases the cost of testing.

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