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A kind of processing method of sapphire sheet

A processing method and sapphire technology, applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve problems such as chipping, inability to process sapphire flakes, and fragmentation

Active Publication Date: 2015-12-02
ZHEJIANG SHANGCHENG SCI&TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Limited by the workpiece fixture of CNC machine tools, the yield of sapphire slices below 1.5mm is not high and is easy to be damaged; at the same time, the existing technology cannot process sapphire slices below 0.5mm by CNC numerical control equipment
[0005] At the same time, for the non-circular hole drilling process of sapphire thin slices, the processing time is too long, the corners are prone to stress concentration, and the edges are chipped or even broken.

Method used

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  • A kind of processing method of sapphire sheet
  • A kind of processing method of sapphire sheet
  • A kind of processing method of sapphire sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as Figure 1~3 As shown, heat 4 sapphire sheets, apply adhesive on the surface of the sapphire sheets, stack the 4 sapphire sheets, and cool down. The thickness of the sapphire block after bonding is controlled by the bonding quantity of the sapphire flakes. Control the thickness of the sapphire block at 10mm~15mm. The adhesive is a polar adhesive whose main components are modified epoxy resin and amino polyether, and can be removed as needed.

[0032] Among them, the punching method of non-circular holes is to punch vertical holes at both ends and the middle first, and then move horizontally. The relationship between line segment L and drill bit diameter R is 2~4:1.

[0033] The CNC three-axis linkage engraving machine is used, and the grinding tool material is electroplated emery, with a particle size of 200 mesh to 1000 mesh. During the processing, the linear speed is above 4m / s, and the sapphire is processed by high-speed grinding and low-feed.

[0034] Pr...

Embodiment 2

[0037] The difference from Example 1 is that, if Figure 4 As shown, the drilling method of non-round holes in this scheme is to drill vertical holes at both ends and the middle first, and then move the drill bit horizontally at an angle of 10°~45° to the horizontal direction. This method can reduce the overall strength requirements of the drill bit, speed up the processing process and save processing time.

[0038] The relationship between the sub-line segment L and the drill bit diameter R is 2:1.

Embodiment 3

[0040] The difference from Example 1 is that, if Figure 5 As shown, the method of drilling non-round holes in this scheme is to first drill vertical holes at both ends and the middle, and then move the double drill bit horizontally and relatively parallel to the horizontal direction at an angle of 10°~45°. This method can reduce the overall strength requirements of the drill bit, speed up the processing process, and further save processing time.

[0041] The relationship between the sub-line segment L and the drill bit diameter R is 4:1.

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Abstract

The invention provides a machining method for sapphire slices. A certain adhesive is required to bond the plurality of sapphire slices to increase the thickness, and the material strength of the sapphire slices is improved. Then, a computer numerical control (CNC) device is used for conducting CNC machining on the bonded sapphire slices, and sapphire is machined in a mode of grinding at the high speed and low feeding. Meanwhile, a non-round hole punching process for the sapphire slices is provided.

Description

technical field [0001] The invention relates to a processing method for sapphire thin slices. Background technique [0002] Sapphire has high hardness, high melting point, good light transmission, and stable chemical properties. It is widely used in high-tech fields such as machinery, optics, and information. Artificially grown sapphire has good wear resistance, and its hardness is second only to diamond, reaching Mohs 9. At the same time, the compactness of sapphire makes it have a large surface tension. The above two characteristics are very suitable for electronic touch panels such as mobile phones. Such sapphire flake profiles have at least one outer contour fillet or at least one hole. Outer contour rounded corners and holes include but are not limited to semicircular arcs and circular holes, and can also be curved arcs, square holes, and elliptical holes. [0003] However, processing artificially grown sapphire into larger-diameter panels requires a huge economic cos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00
Inventor 吴云才
Owner ZHEJIANG SHANGCHENG SCI&TECH