A j-type isolating switch contact finger electroplating process
An electroplating process and contact finger technology, which is applied in the field of electroplating process for J-type isolating switch contacts, can solve the problems of resource waste cost, reduce production efficiency, increase workload, etc., and achieve the effect of saving cost, reducing adhesion, and good contact
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Embodiment 1
[0020] The contact finger is 8mm away from the inner wall of the shielding cover. The electroplating follows the normal process. The current of the silver plating tank is 70A, and the electroplating time is 60min. The average thickness of the silver-plating working area is 12 microns, and the average thickness of the non-working area is 10 microns, which does not meet the manufacturing standards of isolating switch contacts;
Embodiment 2
[0022] The contact finger is 8mm away from the inner wall of the shielding cover. The electroplating follows the normal process, the current of the silver plating tank is 80A, and the electroplating time is 60min. The average thickness of the silver-plating working area is 18 microns, and the average thickness of the non-working area is 14 microns, which does not meet the manufacturing standards of isolating switch fingers;
Embodiment 3
[0024] The contact finger is 7mm away from the inner wall of the shielding cover. The electroplating is in accordance with the normal process. The current of the silver plating tank is 80A, and the electroplating time is 60min. ;
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Abstract
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