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Wafer positioning and thickness measuring device

A wafer thickness measurement technology, applied in the direction of measuring devices, optical devices, semiconductor/solid-state device testing/measurement, etc., can solve the problems of low accuracy of chamfering edge width, poor uniformity of wafer dimensions, etc., to achieve The effect of improving the automation level of equipment, saving space and improving detection efficiency

Active Publication Date: 2016-07-06
CHINA ELECTRONIC TECH GRP CORP NO 2 RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a wafer positioning and thickness measuring device, which solves the problem that the existing chamfering equipment performs chamfering through rough positioning without identification. Technical problem of low width accuracy

Method used

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  • Wafer positioning and thickness measuring device
  • Wafer positioning and thickness measuring device
  • Wafer positioning and thickness measuring device

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Embodiment Construction

[0011] Below in conjunction with accompanying drawing, the utility model is described in detail:

[0012] A wafer positioning and thickness measuring device, comprising a PLC and an adsorption table platen 1, a shaft passing hole is arranged on the adsorption table platen 1, and the adsorption table platen below the axis passing hole on the adsorption table platen 1 A bearing with seat 2 is fixedly arranged on the lower bottom surface of the suction table, the shaft 3 is arranged in the bearing with seat 2, a servo motor seat 4 is fixedly arranged on the lower bottom surface of the adsorption platform, and a servo motor 5 is arranged on the servo motor seat 4, The output shaft of the servo motor 5 is connected with the lower end of the shaft 3 through a coupling 6, a dynamic seal seat 7 is arranged on the adsorption platform 1, a vacuum introduction box 8 is arranged on the dynamic seal seat 7, and the shaft 3 The upper end passes through the driven sealing seat 7 and the vacu...

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PUM

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Abstract

The invention discloses a wafer positioning and thickness measuring apparatus. By using current chamfering equipment, rough positioning without identification is used to carry out chamfering so that homoousia of a shape and a size of the wafer after the chamfering is poor. By using the apparatus of the invention, the above problem is solved. A mounted bearing (2) is fixedly arranged on a lower bottom surface of an adsorption bench plate, wherein the lower bottom surface is below a shaft through hole on the adsorption bench plate. An output shaft of a servo motor (5) is connected with a lower end of a shaft through a coupling (6). The adsorption bench plate is provided with a dynamic sealing seat (7) and a vacuum leading-in box (8). An upper end of the shaft successively passes through the dynamic sealing seat (7) and the vacuum leading-in box (8). A top frame of an inverted L shape thickness gauge support (17) is provided with a non-contact thickness gauge (18). The adsorption bench plate of a left side of the dynamic sealing seat is provided with a linear motor stator (19) and a linear motor rotor (20). The linear motor rotor is provided with a light curtain emitter of a laser length detecting instrument and a light curtain receiver of the laser length detecting instrument. Positioning and detection efficiency is increased.

Description

technical field [0001] The invention relates to a wafer positioning and thickness measuring device, which belongs to the core component of a chamfering machine, and can be used as a separate detection instrument in the semiconductor industry to realize the detection of the shape, size, center position and thickness of the wafer edge . Background technique [0002] With the development of integrated circuits towards high frequency, ultra-high frequency, and ultra-large scale, the requirements for wafer quality are getting higher and higher. Chamfering is the process of shaping the contour of the wafer, which can reduce the edge fragmentation rate of the wafer during grinding, polishing, and device manufacturing. Before chamfering, it is necessary to identify and position the wafer to determine its processing. parameter. The existing chamfering equipment performs chamfering through rough positioning without identification, which causes problems such as poor uniformity of waf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67G01B11/00G01B11/06G01B11/24
CPCG01B11/00G01B11/06G01B11/24H01L21/67259H01L22/12
Inventor 牛进毅张峰苗岱贾娟芳
Owner CHINA ELECTRONIC TECH GRP CORP NO 2 RES INST