Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor laser

A semiconductor and laser technology, applied in the field of lasers, can solve the problems of large parasitic effect, large volume and complex production process.

Inactive Publication Date: 2014-03-19
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
View PDF1 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Since the various functional components of the semiconductor laser mentioned above are packaged separately, not only the volume is large, the parasitic effect is large, but the manufacturing process is relatively complicated, which reduces the stability of the system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor laser
  • Semiconductor laser
  • Semiconductor laser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0019] figure 1 The overall structure diagram of the semiconductor laser proposed by the present invention is shown. The semiconductor laser described above is a device in which all functional components are wrapped by encapsulating materials, and has the functions of signal shaping, signal amplification, laser emission, and beam collimation or shaping. Its appearance is cylindrical, while the light-emitting end surface is ellipsoidal. Such as figure 1 As shown, the semiconductor laser includes a metal bracket 1 , a driving module 2 , a semiconductor laser tube 3 , a beam collimating lens 4 and a packaging material 5 . The layout of each component in the semiconductor laser makes the electrical signal input from the me...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Pulse widthaaaaaaaaaa
Divergence angleaaaaaaaaaa
Login to View More

Abstract

The invention discloses a semiconductor laser. The semiconductor laser at least comprises a semiconductor laser tube, a driving module, a collimating lens, a metal support and an encapsulating material, wherein through the layout of all parts in the semiconductor laser, an electric signal which is inputted from the metal support can drive the semiconductor laser tube after being shaped and amplified by the driving module, laser transmitted by the semiconductor laser tube is collimated by the collimating lens to be shot in a small divergence angle; the collimating lens is made of an encapsulating material, i.e. the semiconductor laser tube, the driving module and the metal support are encapsulated together while the collimating lens is produced, so that all parts can be integrated. The semiconductor laser is small in size, small in output optical pulse width and large in driving voltage.

Description

technical field [0001] The invention relates to the fields of laser technology, laser driving technology, beam shaping technology and packaging technology, in particular to a semiconductor laser. Background technique [0002] High-power semiconductor lasers are an important laser light source in scientific research, industry and military fields, and are often used in proximity fuzes for missiles and artillery shells. This laser is characterized by high efficiency, small size, and light weight. Due to the limitation of precision, semiconductor lasers are required to meet the requirements of high peak power and small pulse width; at the same time, in order to meet the standards for military applications, semiconductor lasers are also required to have the characteristics of small size and strong impact resistance. [0003] Usually, a semiconductor laser used for a laser proximity fuze includes three parts: a semiconductor laser tube, a driving circuit, and a beam collimation s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01S5/06
Inventor 罗达新赵柏秦
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com