Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

RF (Radio Frequency) base card embedded with multilayer wiring type film capacitor

A film capacitor and base card technology, applied in the RF base card field, can solve the problems of uneven surface, unreliable connection between RF coil and pin capacitor, poor stability, etc., and achieve the effect of smooth surface, small thickness and good stability

Inactive Publication Date: 2014-03-26
BEIJING BASCH SMARTCARD +1
View PDF7 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the main purpose of the present invention is to provide an RF base card with embedded multilayer wiring type film capacitors, to solve the problem of uneven surface after base card packaging in the base card manufacturing dual-interface IC card in the prior art. The technical problem of unreliable and poor stability of the connection between the coil and the pin capacitor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • RF (Radio Frequency) base card embedded with multilayer wiring type film capacitor
  • RF (Radio Frequency) base card embedded with multilayer wiring type film capacitor
  • RF (Radio Frequency) base card embedded with multilayer wiring type film capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to make the above objects, features and advantages of the present invention more comprehensible, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0035] The embodiment of the present invention is aimed at the production of the base card of the coupled dual-interface IC card in the prior art. The pin capacitor has a large thickness and is embedded in the base card, resulting in an uneven surface after the base card is packaged; the connection between the pin capacitor and the RF antenna is unreliable. , easy to disengage; conventional IC card manufacturing equipment cannot be used for large-scale industrial production, and a series of problems such as low production efficiency provide a radio frequency RF base card embedded with multi-layer wiring film capacitors, including: multi-layer Wire-type film capacitors, ultrasonic wire-wound RF coils, a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an RF (Radio Frequency) base card embedded with a multiplayer wiring type film capacitor. The base card comprises a multilayer wiring type film capacitor, an RF coil and a card substrate, wherein the multilayer wiring type film capacitor comprises a first plate electrode, a second plate electrode and an electric medium layer between the first plate electrode and the second plate electrode; the welding position or lead position of the first plate electrode is coplanar with the welding position or lead position of the second plate electrode; the multilayer wiring type film capacitor is embedded into the card substrate; the RF coil is embedded into the card substrate by adopting an ultrasonic winding way; one end of the RF coil is connected with either plate electrode of the multilayer wiring type film capacitor, and the other end of the RF coil is connected with the other plate electrode of the multilayer wiring type film capacitor. The film capacitor is small in thickness, the base card is high in flatness, the film capacitor is reliably connected with the RF coil, and the base card is particularly applied to a coupled dual-interface IC (Integrated Circuit) card.

Description

technical field [0001] The invention relates to the technical field of integrated circuits and information interaction, in particular to an RF base card embedded with multilayer wiring film capacitors. Background technique [0002] For a dual-interface IC card integrating contact and non-contact, because its shape is consistent with that of a contact IC card, it has a carrying electrode diaphragm and its metal contacts that meet international standards. The internal structure of the dual-interface IC card is similar to that of the non-contact IC card. The antenna in the card base is connected to the chip to form an RFID (Radio Frequency Identification, radio frequency identification) module. within 10cm) to access the chip by radio frequency. Dual-interface IC card combines the advantages of contact IC card and non-contact IC card, and has wide applicability. [0003] A base card with an RF (Radio Frequency, wireless radio frequency) circuit is an important component of a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077H01G4/33H01G4/005H01G4/06
Inventor 刘彩凤闾邱祁刚王丹宁
Owner BEIJING BASCH SMARTCARD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products