Method and system for controlling chip die bonder

Abstract

The invention provides a method and a system for controlling a chip die bonder. The method comprises the steps of: acquiring the image of a motion platform, and the image includes the information of a wafer; determining the position relationship between the wafer on the motion platform and an operated object according to the image; controlling the movement of an end effector according to the acquired position relationship, so that the wafer on the motion platform moves to a target position; controlling the end effector for die bond. The method and the system control the die bonder in a vision-guided mode; therefore, the positioning effect is good, and the problems of the jitter of mechanical platform motion and the overall deviation of the positioning location can be resolved.

Description

technical field [0001] The invention belongs to the field of semiconductor package control, and in particular relates to a control method and a control system of a chip bonder. Background technique [0002] The structure of the three-dimensional die-bonding platform is composed of the X-axis motion system, the Y-axis motion system, the Z-axis motion system and the terminal die-bonding valve. The three-dimensional coordinates of the fixed position are given, and the manipulator performs repeated positioning of the circuit board chip position, and then controls the end-fixing valve. Crystal valve for chip bonding. [0003] However, due to the diversity and flexibility of operating circuit boards, the applicability of the three-dimensional die-bonding positioning platform with fixed XYZ coordinates is very poor, and the mechanical screw is worn after repeated positioning, resulting in positioning accuracy that cannot reach the expected set indicators. At present, most die bon...

AI Technical Summary

Problems solved by technology

[0003] However, due to the diversity and flexibility of operating circuit boards, the applicability of the three-dimensional die-bonding positioning platform with fixed XYZ coordinates is very poor, and the mechanical screw has corresponding wear after repeated positioning, resulting in positioning accuracy that is not as expected. set indicators

At present, most die bonder systems have poor repeatability and low assembly or operation accuracy during assembly or operation. Many systems still require semi-automatic assembly with human participation and cannot be fully autonomously assembled or operated.

[0004] The existing vision-guided die-bonding machines often have missing operations of position targets during multi-target recognition (that is, multiple chip positions cannot be fully recognized, resulting in abnormal die bonding), and multi-target chip position recognition on complex circuit boards. There is no corresponding solution for positioning

In addition, the calibration of the internal and external parameters of the visual camera is usually carried out using calibration blocks. The results of such calibration often depend on the accuracy of human calibration, so the positioning effect of the system is often poor, and the movement of the mechanical platform appears to be jittery and the overall deviation of the positioning position. shift

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