Heat dissipation optimizing structure for precise device in inertial navigation product

Abstract

The invention provides a heat dissipation optimizing structure for a precise device in an inertial navigation product. The precise device is contained in an installation hole of a box body and a gap between the precise device and the box body is filled with a soft silica gel heat-conductive fin. One face of the soft silica gel heat-conductive fin makes tight contact with the surface of the precise device and the other face of the soft silica gel heat-conductive fin makes tight contact with the rear surface of a heat dissipation device fixedly connected with the box body. The soft silica gel heat-conductive fin is arranged in the gap between the precise device and the box body so that the air gap can be eliminated, thermal contact resistance between the precise device and the box body can be reduced, heat generated by the precise device can be rapidly conducted to the surface of the box body, a thermal field inside the product can be balanced rapidly, and influence on performance indexes of the precise device by the environment temperature can be reduced. Meanwhile, heat is dissipated in a conductive mode, a convective mode and a radiant mode, so that the heat dissipation effect is good, the reliability of the product is improved, the service life of the product is prolonged, the structure is easy to obtain, and the usability is high.

Description

technical field [0001] The invention belongs to the technical field of thermal design of inertial navigation products, and in particular relates to a heat dissipation optimization structure for precision devices in inertial navigation products. Background technique [0002] For inertial navigation electronic products, the system integration level continues to increase, the system power consumption continues to increase, and the box volume continues to decrease, resulting in increased temperature rise on the surface of precision devices and the environment, directly affecting the performance of each functional module of the product, resulting in Degradation of precision device performance, lifetime and reliability. In addition, temperature has a great influence on the accuracy of precision devices. When the temperature rises, the parameter drift will increase, resulting in a decrease in the performance and life of precision devices, which will eventually affect the performanc...

AI Technical Summary

Problems solved by technology

[0002] For inertial navigation electronic products, the system integration level continues to increase, the system power consumption continues to increase, and the box volume continues to decrease, resulting in an increase in the temperature rise of the surface of precision devices and the environment, which directly affects the performance of each functional module of the product, resulting in Degradation of precision device performance, lifetime and reliability

In addition, temperature has a great influence on the accuracy of precision devices. When the temperature rises, the parameter drift will increase, resulting in a decrease in the performance and life of precision devices, which will eventually affect the performance and life of the product. Therefore, heat dissipation for precision devices is a must. A very important link in product thermal design

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