The invention discloses a structure of a semiconductor heating component. The structure comprises an upper heat dissipation unit, an upper insulating material base body, an insulating rubber ring, a lower insulating material base body, a lower heat dissipation unit and a fixing device. The insulating rubber ring is even in thickness. The upper insulating material base body is arranged above the insulating rubber ring. The lower insulating material base body is arranged below the insulating rubber ring. The upper heat dissipation unit is arranged above the upper insulating material base body. The lower heat dissipation unit is arranged below the lower insulating material base body. The corresponding position of the upper heat dissipation unit, the corresponding position of the upper insulating material base body, the corresponding position of the insulating rubber ring, the corresponding position of the lower insulating material base body and the corresponding position of the lower heat dissipation unit are provided with a through hole. Internal threads are arranged in the through hole and evenly distributed around the upper heat dissipation unit and the lower heat dissipation unit. The fixing device penetrates through the through hole so that the through hole can be fixed. The structure has the advantages of being simple in structure, efficient, capable of saving energy, long in service life, high in comfort level, rapid in heating, gentle in heat source, high in safety, healthy, environmentally friendly, capable of conducting low-temperature heat dissipation and capable of maintaining the humidity. The structure is mainly used for indoor heating.