Fuse circuit capable of stimulating fusing
A fuse and fusing technology, applied in information storage, static memory, instruments, etc., can solve the problems of unusable, increased chip cost, irreversibility, and only one-time fusing, etc., to reduce manufacturing costs and increase yields Effect
Active Publication Date: 2014-04-02
CRM ICBG (WUXI) CO LTD
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Problems solved by technology
[0003] There are two commonly used fuse technologies at present: one is to use laser (or current) to blow the fuse. The fuse material is generally polysilicon, metal aluminum or copper, etc. The disadvantage of this fuse technology is that the operation process is irreversible. Only one-time fusing can be performed, and the fuse after fusing cannot be reconnected. If the chip performance cannot meet the requirements after fusing, the product cannot be used; the other is to change the logic state by programming through electrical signals. The advantages of this fuse technology It can be repeatedly fused, but the disadvantage is that a large amount of memory will be added, such as Flash Memory (flash memory), EPROM (Electrically Programmable Read-Only-Memory, Electrically Programmable Read-Only Memory), etc., which greatly increases the cost of the chip, and Increased requirements for the production process
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[0021] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0022] Reference herein to "one embodiment" or "an embodiment" refers to a particular feature, structure or characteristic that can be included in at least one implementation of the present invention. "In one embodiment" appearing in different places in this specification does not all refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments. Unless otherwise specified, the words connected, connected, and joined in this document mean that they are electrically connected directly or indirectly.
[0023] Please refer to figure 1 As shown, it is a schematic diagram of a fuse circuit that can simulate blown in one embodiment of the present invention. The fuse circuit...
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The invention provides a fuse circuit capable of stimulating fusing. The fuse circuit comprises a fuse, a first setting circuit, a second setting circuit and a latch, wherein the output end of the first setting circuit is connected with a first connection end of the fuse; the output end of the second setting circuit is connected with the output end of the fuse circuit; the input end of the latch is connected with a second connection end of the fuse; and the output end of the latch is connected with the output end of the fuse circuit. When the fuse is fused, the second setting circuit enables the output end of the fuse circuit to output a fusing signal; when the fuse is not fused and needs to stimulate fusing, the first connecting end is set to a fusing setting level, and the fusing setting level enables the output end of the fuse circuit to output the fusing signal. Compared with the prior art, the fuse circuit capable of stimulating the fusing can be used for stimulating the fusing effect of the fuse, so that the circuit properties of a chip is tested by stimulating the fusing of the fuse through the fuse circuit, and furthermore, the yield of the chip is improved.
Description
【Technical field】 [0001] The invention relates to the field of circuit design, in particular to a fuse circuit capable of simulating fusing. 【Background technique】 [0002] In the manufacturing process of integrated circuits (that is, chips), factors such as the deviation of process parameters will have a great impact on the circuit performance of the chip. In order to improve the yield and quality of the chip, the fuse technology is usually used in the wafer testing stage. That is, the performance of the chip can be precisely adjusted by selectively blowing the pre-designed fuse in the chip. [0003] There are two commonly used fuse technologies at present: one is to use laser (or current) to blow the fuse. The fuse material is generally polysilicon, metal aluminum or copper, etc. The disadvantage of this fuse technology is that the operation process is irreversible. Only one-time fusing can be performed, and the fuse after fusing cannot be reconnected. If the chip perform...
Claims
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Login to View More IPC IPC(8): G11C17/16G11C17/18
Inventor 刘玉芳罗先才徐栋严淼沈天平孙静徐宵隽
Owner CRM ICBG (WUXI) CO LTD