A kind of silicon block polishing device and silicon block polishing method

Abstract

The invention discloses a silicon block polishing device which comprises a first polishing unit and a second polishing unit. A grinding part of the first polishing unit is a carborundum grinding stone, and a grinding part of the second polishing unit is a hairbrush. The hairbrush is a combined hairbrush and comprises a first hairbrush body and a second hairbrush body, the first hairbrush body is located inside the hairbrush, the second hairbrush body is located on the outer side of the first hairbrush body, and the number and the lengths of brush bristles of the second hairbrush body are both larger than the number and the lengths of brush bristles of the first hairbrush body. According to the silicon block polishing device, a silicon block is polished in two working procedures through the carborundum grinding stone and the hairbrush in sequence, the silicon block polishing effect can be remarkably improved, and therefore the silicon block cutting quality is guaranteed. The invention further discloses a method for polishing the silicon block through the silicon block polishing device.

Description

technical field [0001] The invention relates to the technical field of solar silicon block processing and manufacturing, in particular to a processing device and a processing method for polishing a silicon block before cutting it into silicon wafers. Background technique [0002] At present, in the silicon wafer production workshop, silicon ingots are processed into silicon blocks by wire cutting (that is, square cutting), and then cut into silicon wafers. During the actual operation of square cutting, any negligence of the staff will affect the silicon block. The cutting quality of the block is mainly divided into saw marks on the surface of the cut silicon block, the middle "bulge" in the size of the silicon block, and the local bending of the shape of the silicon block caused by broken wires. These defects will cause difficulties for subsequent polishing. In addition, A damaged layer of about 20 microns will be produced on the surface of the silicon block cut by the steel...

AI Technical Summary

Problems solved by technology

[0004] The existing technology mainly uses a brush to grind the silicon block. The brush polishing can remove the damaged layer and reduce the number of invisible cracks, chipping and debris. The disadvantage is that the texture of the brush is soft, the polishing speed is slow, and the consumption is fast. If the brush is used For the silicon block with "bulging" problem, due to the limited polishing ability of the brush-type grinding wheel, the large size in the middle cannot be removed, which will affect the polishing quality.

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