Non-symmetric flex-rigid combination circuit board and manufacturing method thereof

Abstract

The invention discloses a non-symmetric flex-rigid combination circuit board and a manufacturing method thereof. The flex-rigid combination circuit board comprises a flexible sub-board, a first medium layer, a first rigid sub-board, a second medium layer and a second rigid sub-board, wherein the flexible sub-board, the first medium layer, the first rigid sub-board, the second medium layer and the second rigid sub-board are sequentially stacked. A thick rigid zone, a flexible zone and a thin rigid zone are arranged on the flexible sub-board. The thick rigid zone is connected with the thin rigid zone through the flexible zone. The first medium layer and the first rigid sub-board are provided with a first windowing zone and a second windowing zone corresponding to the flexible zone respectively. A third windowing zone corresponding to the flexible zone and the thin rigid zone is arranged on the second medium layer. A fourth windowing zone corresponding to the third windowing zone is arranged on the second rigid sub-board. According to the manufacturing method of the non-symmetric flex-rigid combination circuit board, windowing manufacturing is carried in a graded mode through secondary pressing, the design requirement for all sorts of thicknesses of clients can be met, the smoothness of the board is greatly improved, risks of board explosion are reduced and the qualification rate is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a rigid-flexible circuit board with asymmetrical rigid area thickness and layers and a preparation method thereof. Background technique [0002] The rigid-flexible printed board can be flexibly and three-dimensionally installed, replacing many transition parts and effectively utilizing the installation space; because the flexible part uses thinner copper foil and thinner medium and does not contain reinforcing materials (such as glass cloth, etc. ), which can manufacture higher density (finer pitch) products; it has the advantages of small size, light weight, and high reliability. At the same time, multiple rigid layers with different structures and designs can be connected through the flexible layer, which can realize the distribution of different functional areas and meet the development trend of multi-functional modularization of electronic products. Due to its ...

AI Technical Summary

Problems solved by technology

[0006] With this method, there are two levels of height difference during lamination, and it is necessary to use an additional pressure distribution plate to level the step area to ensure the lamination effect. The existence of the pressure distribution plate will cause insufficient flow of glue on the surface of the board. ;Secondly, in circuit production, if the length of the flexible area is small, when the pressure roller film is used, it is difficult to stick the film tightly in the height difference area, so that the edge circuit cannot be produced. Due to the drop, the scraper cannot travel on the same plane, which will cause the ink to accumulate on the thin plate and cannot be scraped off

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