Preparation method of fullerene-polyimide conductive film

A polyimide, conductive film technology, applied in the field of material processing, to achieve the effect of reducing surface conductivity, increasing elastic modulus, and increasing rigidity

Inactive Publication Date: 2014-04-23
QINGDAO ADVANCED MARINE MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of static electricity is quite harmful in ships, aircrafts and electronic components, and will cause extremely serious consequences such as capacitor breakdown and damage to electronic components.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The fullerene-polyimide conductive film was prepared by the following method:

[0015] (1) Add 2000ml of solvent o-dichlorobenzene and 80g of 4,4'-dioctyldiphenylamine (ODA) to the container, add 100g of pyromellitic dianhydride (PMDA) while stirring, and react for 3h to generate a polyamic acid solution (2) Add 0.15g of fullerene powder to the above solution, carry out ultrasonic treatment, ultrasonic power is 200W, ultrasonic treatment for 1h at a temperature of 25 ℃, and then increase the temperature to 35 ℃ and ultrasonic treatment for 1 h to obtain rich Leene-polyamic acid solution; (3) Lay the above solution on a glass plate and level it, remove the solvent o-dichlorobenzene in a common oven, and place it in a vacuum oven to make the fullerene-polyamide The acid imidization is complete, thereby obtaining a fullerene-polyimide conductive film.

[0016] The elastic modulus of the prepared fullerene-polyimide conductive film is 2.82GPa, the tensile strength is 184MP...

Embodiment 2

[0018] The fullerene-polyimide conductive film was prepared by the following method:

[0019] (1) Add 3000ml of solvent o-dichlorobenzene and 100g of 4,4'-dioctyldiphenylamine (ODA) to the container, add 100g of pyromellitic dianhydride (PMDA) while stirring, and react for 3h to generate a polyamic acid solution (2) Add 0.2g of fullerene powder to the above solution, carry out ultrasonic treatment, ultrasonic power is 200W, ultrasonic treatment is carried out at 25 ° C for 1 h, and then the temperature is increased to 35 ° C and ultrasonic treatment is carried out for 1 h to obtain rich (3) Lay the above solution on a glass plate and level it, remove the solvent o-dichlorobenzene in a common oven, and place it in a vacuum oven to make the fullerene-polyamide The acid imidization is complete, thereby obtaining a fullerene-polyimide conductive film.

[0020] The elastic modulus of the prepared fullerene-polyimide conductive film is 2.88GPa, the tensile strength is 193MPa, the e...

Embodiment 3

[0022] The fullerene-polyimide conductive film was prepared by the following method:

[0023] (1) Add 2000ml of solvent o-dichlorobenzene and 120g of 4,4'-dioctyldiphenylamine (ODA) to the container, add 100g of pyromellitic dianhydride (PMDA) while stirring, and react for 3h to generate a polyamic acid solution (2) Add 0.3g of fullerene powder to the above solution, carry out ultrasonic treatment, ultrasonic power is 200W, ultrasonic treatment is carried out at 25 ° C for 1 h, and then the temperature is increased to 35 ° C and ultrasonic treatment is carried out for 1 h to obtain rich (3) Lay the above solution on a glass plate and level it, remove the solvent o-dichlorobenzene in a common oven, and place it in a vacuum oven to make the fullerene-polyamide The acid imidization is complete, thereby obtaining a fullerene-polyimide conductive film.

[0024] The elastic modulus of the prepared fullerene-polyimide conductive film is 2.76GPa, the tensile strength is 174MPa, the e...

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Abstract

The invention relates to a preparation method of a fullerene-polyimide conductive film, which comprises the following steps: (1) adding solvents of o-dichlorobenzene and ODA in a container, adding PMDA while stirring, reacting for 3 hours to generate a polyamide acid solution; (2) adding fullerene powder into the above solution, performing ultrasonic processing for 2 hours, keeping the temperature at 25-35 DEG C during the ultrasonic process to obtain a fullerene-polyamide acid solution; (3) spreading the above solution on a glass plate, strickling the film, removing the solvent of o-dichlorobenzene in a common baking oven, putting the film in a vacuum baking oven to realize complete imidization of fullerene-polyamide acid so as to obtain the fullerene-polyimide conductive film. The preparation method of the invention can reduce surface conductivity of polyimide, prevent static electricity, and extend the application scope.

Description

technical field [0001] The invention relates to a preparation method of a fullerene-polyimide conductive film, which belongs to the field of material processing. technical background [0002] In the prior art, polyimide high-efficiency heat-insulating and sound-absorbing lightweight materials are resistant to high and low temperatures, low in density, non-toxic, smokeless, convenient and safe in construction, and good in sound absorption performance. They are ideal for ships, aerospace, high-speed trains and other fields. An excellent choice for heat insulating and sound absorbing materials. However, the surface resistivity of polyimide film is at the level of 1016Ω / square, and its conductivity is not good. It can be used as an insulating material by itself. However, with the expansion of the space field, the application of polyimide materials in aerospace engineering It is becoming more and more extensive, and the requirements for its various performances are also differ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K3/04C08J5/18C08L79/08
Inventor 刘连河刘培礼胡松霞韩世辉
Owner QINGDAO ADVANCED MARINE MATERIAL TECH
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