The invention provides a super
heat resistance and
high heat conduction
epoxy molding compound used for
semiconductor packaging. The super
heat resistance and
high heat conduction
epoxy molding compound used for
semiconductor packaging comprises the following components in parts by weight: 45 to 127.5 parts of
epoxy resin, 60 to 300 parts of a curing agent, 3.75 to 10.35 parts of an
ion trapping agent, 3.9 to 15 parts of a
low stress modifier, 3 to 6.75 parts of a
coupling agent, 0.9 to 9 parts of an
accelerant, 525 to 672.25 parts of a
solid filler, 3 to 12 parts of a releasing agent, 2.25 to5.25 parts of a
fire retardant and 1.5 to 2.25 parts of a coloring agent. In the super
heat resistance and
high heat conduction epoxy molding compound used for
semiconductor packaging provided by theinvention, ester ring epoxy resin, heterocyclic ring epoxy resin,
naphthalene ring epoxy resin and multifunctional group epoxy resin are added as a
resin matrix, the resin is of a
rigid structure, amolecular chain is unlikely to move, and simultaneously the cross-linking density after the resin is cured can be enlarged due to the fact that the resin is of a multifunctional structure, so that theeffect of increasing the glass-
transition temperature of the material is reached, and the heat resistance of the material is improved.