The invention provides a super heat-resistant and high thermal conductive
epoxy plastic sealing compound for
semiconductor packaging, which contains the following components: 45-127.5 parts by weight of
epoxy resin, 60-300 parts by weight of curing agent, and 3.75-10.35 parts by weight of
ion trapping agent , 3.9-15 parts by weight of
low stress modifier, 3-6.75 parts by weight of
coupling agent, 0.9-9 parts by weight of accelerator, 525-672.25 parts by weight of
solid filler, 3-12 parts by weight of mold
release agent, 2.25 parts by weight of
flame retardant -5.25 parts by weight, 1.5-2.25 parts by weight of colorants. In the super-heat-resistant and high-thermal-
conductivity epoxy molding compound for
semiconductor encapsulation provided by the present invention, ester ring epoxy resin, heterocyclic epoxy resin,
naphthalene ring epoxy resin, and multifunctional epoxy resin are added as resins. Matrix, this kind of
grease has a
rigid structure, which makes the molecular chain difficult to move. At the same time, because the resin has a multifunctional structure, it can increase the crosslinking density after curing of the resin, thereby achieving the effect of increasing the
glass transition temperature of the material and increasing the
heat resistance of the material. .