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A detection and positioning method for spherical pin components

A technology of pin components and positioning methods, which is applied in image data processing, instruments, calculations, etc., and can solve problems such as poor real-time performance, inflexibility, and high precision requirements

Active Publication Date: 2017-02-08
宁波智能装备研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the current BGA component positioning technology does not involve the integrity inspection of BGA component solder balls and the template matching algorithm has high requirements for standard template accuracy, is not flexible enough, has poor real-time performance, and the current BGA component positioning technology has low positioning accuracy. , and a detection and localization method for spherical pin components is proposed

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  • A detection and positioning method for spherical pin components
  • A detection and positioning method for spherical pin components
  • A detection and positioning method for spherical pin components

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specific Embodiment approach 1

[0024] Specific Embodiment 1: A detection and positioning method for spherical pin components in this embodiment is specifically prepared according to the following steps:

[0025] Step 1, using an optical lighting system to obtain the image of the BGA component, wherein the BGA component is a BallGridArray spherical pin component;

[0026] Step 2, using the maximum inter-class variance method to perform threshold segmentation on the image of the BGA component to obtain a binary preprocessed image, which is a binary image;

[0027] Step 3, using a marking algorithm to mark each connected region of the binary image, and setting each connected region as a foreground, thereby obtaining a binary ROI image of each BGA component solder ball;

[0028] Step 4, calculate the area of ​​each connected region marked in step 3, and exclude the BGA component solder ball whose connected region area is not within the area range of the BGA component solder ball; if the area is too small, it ma...

specific Embodiment approach 2

[0035] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the specific process of using the marking algorithm to mark each connected region of the binary image as described in step 3 is:

[0036] The connected region labeling algorithm can be implemented by two-pass scanning method:

[0037] Step 1. Scan the binarized ROI image of the solder ball of the BGA component for the first pass, and obtain the temporary label of the pixel of the binarized ROI image:

[0038](1) Using the 8-neighborhood connectivity rule, the 8-neighborhood coordinates are (x-1, y), (x+1, y), (x, y-1), (x, y+1), (x- 1, y-1) (x-1, y+1), (x+1, y-1) and (x+1, y+1), the temporary connected domain labels for all pixels of the entire image, Obtain the temporary connected domain label matrix of the binarized ROI image pixel point; set a certain binary ROI image pixel point (x, y), and the temporary connected domain label of the binarized ROI image pixel point is la...

specific Embodiment approach 3

[0047] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the area of ​​each connected area marked in the calculation step three described in step four, and exclude the area of ​​the connected area not within the area range of the solder ball of the BGA component The specific process of BGA component solder balls is:

[0048] (1) The area of ​​the connected region is the number of pixels in the connected region;

[0049] (2) For each solder ball of the BGA, the image area after binarization is within the area of ​​the BGA component solder ball. For the same spherical pin component, the size of the spherical solder joints is basically the same, where the spherical Solder joints are BGA solder balls;

[0050] (3) The interference existing in the binarized image will also be marked in the process of marking the connected area, but the interference area is generally very small and can be directly eliminated;

[0051] (4) In o...

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Abstract

The invention discloses a detection and positioning method used for a spherical pin element, relates to a detection and positioning method of a pin element, and aims at solving the problems that the current positioning technology does not relate to the integrity inspection of a BGA (Ball Grid Array) element solder ball and the requirement of a template matching algorithm on template precision is high, the method is not flexible, the instantaneity is poor, and the positioning precision is not high. The method comprises the steps of 1, obtaining an image of a BGA element; 2, obtaining an image after binaryzation preprocessing; 3, obtaining a binaryzation ROI image; 4, marking the area of each connected region; 5, detecting the marked connected regions; 6, detecting the BGA solder ball through representing the connected region of the spherical pin by the center of an orthometric connected region; 7, dividing four boundary regions of a BGA element periphery solder ball; 8, calculating the rotation angle and the coordinates of a central point. The detection and positioning method is applied to the fields of detection and positioning of the spherical pin element.

Description

technical field [0001] The invention relates to a detection and positioning method for spherical pin components. Background technique [0002] Area array package components are made of spherical bumps in an array at the bottom of the chip. The spherical bumps are used to replace rectangular pins to form a signal transmission path between the chip and the PCB substrate. They are called spherical pin components. In recent years To be widely used in various electronic products. [0003] The spherical pins of the area array package components are the characteristics of this type of components, and the precise positioning of the entire component is indirectly realized through the detection and positioning of the spherical pins. In order to ensure a good connection between this type of component and the PCB, the detection algorithm also needs to detect the radius, spacing and number of ball pins to detect missing, redundant, misplaced or bridged solder balls that may exist in the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/00
Inventor 高会军周亚飞张欢欢邱一帆李志成丁长兴孙昊
Owner 宁波智能装备研究院有限公司
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