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Heat dissipation structure of t/r module and design method of heat pipe in the structure

A design method, heat pipe technology, applied in lighting and heating equipment, cooling/ventilation/heating renovation, indirect heat exchangers, etc. problem, to achieve the effect of light weight, high reliability and small size

Active Publication Date: 2016-04-06
CNGC INST NO 206 OF CHINA ARMS IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Among the heat dissipation methods conventionally used in T / R components, the cooling methods currently used in China include forced air cooling, liquid cooling and evaporative cooling, etc., the forced air cooling has limited heat dissipation capacity, and the liquid cooling and evaporative cooling equipment are complex, large in size, Disadvantages such as easy leakage

Method used

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  • Heat dissipation structure of t/r module and design method of heat pipe in the structure
  • Heat dissipation structure of t/r module and design method of heat pipe in the structure

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Embodiment Construction

[0029] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:

[0030] Referring to the accompanying drawings, the detailed description will be given on the application of the embodiment based on the heat pipe radiator device and the radiator device based on the combination of heat pipe radiator and air cooling in a certain T / R assembly.

[0031] see figure 1 , this embodiment adopts the heat conduction form of heat pipe, which is composed of 5 T / R components 1, cold plate 2, heat pipe 3, heat sink 4, etc., and 5 T / R components 1 are fixed on the cold plate 2 by screws 5, so that The bottom surface is completely attached to the cold plate 2. At the same time, one end of the heat pipe 3 is welded to the back of the cold plate 2, and the other end is welded to the heat sink 4. In this way, five T / R components 1, cold plate 2, heat pipe 3, and heat sink 4 are connected. Solder and assemble into an independent transceiver assemb...

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Abstract

The invention relates to a heat-radiating structure of a T / R component and a design method for a heat pipe in the structure. The heat-radiating structure of the T / R component is characterized in that: the T / R component is fixed on a cold plate via a screw, the upper part of the cold plate is provided with heat-radiating fins, and another panel of the cold plate opposite to the one on which the T / R component is fixed is provided with the heat pipes; the heat pipes are swirled on the cold plate and bent to be serpentine, wherein one end is welded on the bottom end of the cold plate, and the other end is welded with the top end of the heat-radiating fins; and the bottom surface of the T / R component is completely clung to the cold plate. The heat pipes are adopted to act as a heat conduction piece so that heat of the T / R component is conducted to the heat-radiating fins. In order to guarantee great heat radiation of the T / R component, the heat-radiating surface of the T / R component is directly clung to the cold plate of an emission sub-array, and the heat pipes are distributed on the reverse surface of the cold plate so that the heat radiated by the T / R component is directly conducted to the cold plate of the emission sub-array. Then the heat is conducted to the upper heat-radiating fins via the heat pipes and then the heat is radiated via blower fans on the upper part of the heat-radiating fins.

Description

technical field [0001] The invention belongs to the technical field of thermal control, and is based on the heat conduction mode of heat pipes, and uses heat pipes to conduct concentrated heat to heat dissipation fins, and specifically relates to a heat dissipation device for T / R components and a design method for heat pipes in the device, which is used for T / R components. The / R component performs heat dissipation treatment to realize the normal and continuous operation of the T / R component. Background technique [0002] An important direction of radar development today is to increase the radar range, improve radar measurement accuracy, and effectively combat various clutter and low-observable targets. Regardless of the frequency band and purpose of the active phased array radar, each or several radiating units are connected with a solid-state T / R component, and an active phased array radar has at least a few hundred. There are as many as thousands of T / R components, so de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20F28D15/04
Inventor 谢清玲刘继鹏吕洋
Owner CNGC INST NO 206 OF CHINA ARMS IND GRP