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Polishing pad and production method thereof

A technology of polishing pad and polyurethane vinyl, which is applied in the field of sapphire polishing, can solve the problems of difficult stirring operation, single manufacturer, scattered flying, etc.

Inactive Publication Date: 2014-04-30
HUBEI DINGHUI MICROELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the specific gravity of this substance is very light. Once the package is opened, it is easy to scatter and fly in the process of adding. When operating, it is necessary to wear protective glasses, protective gloves, protective masks and other protective tools, and it is not easy to stir.
In addition, the manufacturer of this substance is single and must rely on foreign imports

Method used

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  • Polishing pad and production method thereof
  • Polishing pad and production method thereof
  • Polishing pad and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0043] A preparation method of a polishing pad includes the following steps:

[0044] 1) The prepolymer reactant is heated to 75°C, the MOCA is heated to 115°C, and then gel is performed at a temperature of 75°C to 115°C. The gel time is about 5 to 15 minutes, wherein the prepolymer The weight ratio of the body reactant to the MOCA is 3.58:1;

[0045] 2) Add the ultra-short polyester fiber or ultra-short aramid fiber with a weight percentage of 1% to 8% to the prepolymer reactant, and use a stirring box to mix the prepolymer reactant with the prepolymer at a speed of 1500rpm to 3500rpm. MOCA is thoroughly stirred and mixed to obtain mixture A;

[0046] 3) Put the mixture A in a centrifuge at 92°C to 110°C for high temperature gelation, and gel for 30 to 90 minutes to obtain a gelled polyurethane sheet;

[0047] 4) Transfer the gelled polyurethane sheet obtained in step 3) to a vulcanization oven, and vulcanize at a temperature of 100°C to 120°C for 10 to 17 hours to obtain a cured po...

Embodiment 1

[0053] Example 1 Test data and results of oxide layer polishing

[0054] 1. Polishing mechanical parameter setting

[0055]

[0056]

[0057] Polishing result:

[0058]

[0059] Polishing rate and polishing flat rate:

[0060]

[0061] From the above test results and image 3 It can be seen that the overall polishing rate of polyurethane polishing pads with polyester added can be improved by fine-tuning the polishing pressure, and the polishing flatness rate is very stable and maintained at about 2%. This flatness rate is relative to the flat rate value of less than or equal to 7% generally recognized in the market. There is a substantial reduction. In chemical mechanical polishing, the lower the global polishing flat rate, the better the overall polishing effect and the higher the yield of the chip.

Embodiment 2

[0062] Example 2 Test data and results of polishing on the metal layer

[0063] Polishing result:

[0064]

[0065]

[0066] Polishing rate and polishing flat rate:

[0067]

[0068] From the above test results and Figure 4 It can be seen that no matter how the polishing test parameters are adjusted, the polishing rate increases or decreases as the polishing parameters change. Polyurethane polishing pads added with 0.5% to 7% polyester fiber powder always show excellent and very stable global flatness. Rate (NU%). And the polishing life is greatly increased.

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Abstract

The invention relates to a polishing pad and a production method thereof. The polishing pad comprises at least two grooves, polyurethane base material, a polyurethane fiber substrate, a polyurethane-ethylene glue layer PSA-A, and a polyurethane-ethylene glue layer PSA-B. One surface of the polyurethane base material is provided with the evenly arranged grooves, and the other surface of the polyurethane base material is glued to one surface of the polyurethane fiber substrate. The other surface of the polyurethane fiber substrate is connected with the polyurethane-ethylene glue layer PSA-B. Ultrashort polyester fiber or ultrashort aramid fiber is added to the polyurethane base material, polyester is an important variety for synthetic fibers, and the polyester fiber's trade name in China is DiLun. The polyester fiber has the advantages of high strength, good elasticity, good wear resistance, acid and alkali resistance, rarity of absorbing moisture and deformation and applicability to chemical mechanical polishing pads.

Description

Technical field [0001] The invention relates to a polishing pad and a preparation method thereof, in particular to a polishing pad added with fiber solid polyurethane and a preparation method thereof, belonging to the fields of semiconductor chip precision polishing, LED substrate polishing and sapphire polishing. Background technique [0002] The semiconductor industry is the core of the modern electronics industry, and the foundation of the semiconductor industry is the silicon material industry. Although a variety of new semiconductor materials continue to appear, more than 90% of semiconductor devices and circuits, especially ultra-large-scale integrated circuits (ULSI), are made on high-purity and high-quality silicon single crystal polished wafers and epitaxial wafers. At present, VLSI manufacturing technology has developed to the 0.25nm and 300mm era. With the further miniaturization of the feature line width, higher requirements are put forward for the planarization of t...

Claims

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Application Information

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IPC IPC(8): B24B37/24B24B37/26B24D18/00
CPCB24B37/22B24B37/26B24B37/24
Inventor 张莉娟
Owner HUBEI DINGHUI MICROELECTRONICS MATERIALS CO LTD
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