Unlock instant, AI-driven research and patent intelligence for your innovation.

Preparation method of light thermal insulating wallboard

A thermal insulation wall panel, lightweight technology, applied in the direction of flat products, household components, household appliances, etc., can solve the problem of low thermal insulation coefficient

Inactive Publication Date: 2014-04-30
牛雅丽
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the currently used building wall materials are earth-fired bricks, which have a low thermal insulation coefficient

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0008] The preparation method of the light-weight thermal insulation wallboard is composed of the following components by weight percentage: 95% of crushed plant straw, shrub branches and leaves, and processed wood waste, 5% formaldehyde-free white latex specially used for thermal insulation wooden wallboard %. When in use, spray the mixed solution glue into crushed plant stalks, shrub branches and leaves, and processed wood waste, etc., and place it in a frame model according to a certain amount, and heat it to 200 degrees for hot pressing. . After exiting the model, place it in a ventilated and dry place for further air drying.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a preparation method of a light thermal insulating wallboard, and specifically relates to a light thermal insulating wallboard with a low heat transfer coefficient for buildings. The light thermal insulating wallboard is composed of 95% of ground plant straws, shrub branches and leaves, wood board processing scraps and the like, and 5% of a formaldehyde-free white latex special for the thermal insulating wood wallboard by weight percentage. In use, the mixed solution glue is sprayed to scraps such as the ground plant straws, the shrub branches and leaves and the wood board processing scraps, and then the mixture is placed in a frame mold by a certain amount, and hot-press-molded at 200 DEG C by heating. Next, the demolded product is placed in a ventilated dry place for further air-drying.

Description

[0001] Technical fields described in the field: [0002] The invention relates to a preparation method of a light-weight heat-insulating wallboard, in particular to a light-weight heat-insulating wallboard for buildings with a low heat transfer coefficient. Background technique: [0003] Most of the currently used building wall materials are earth-fired bricks, which have a low thermal insulation coefficient. Invention content: [0004] In order to overcome the above-mentioned shortcomings in the prior art, the object of the present invention is to provide a method for preparing a lightweight thermal insulation wallboard. This kind of lightweight thermal insulation wallboard can achieve sufficient heat insulation effect, can be installed on the inner side of the building wall, and can replace the secondary decoration with its own pattern. [0005] Technical scheme of the present invention is: [0006] A method for preparing a lightweight heat-insulating wallboard. The inve...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/08
Inventor 牛雅丽
Owner 牛雅丽
PatSnap Eureka logo

PatSnap Eureka turns technology decisions into work you can execute. Powered by our Innovation Knowledge Graph, it runs expert workflows across engineering, life sciences, materials and intellectual property. Get your review-ready output in minutes.

X (Twitter)LinkedInYouTubeSubstack

© 2026 PatSnap. All rights reserved. 

Terms of Service

 | 

Privacy policy

 | 

Modern Slavery Act Transparency Statement