Substrate roasting device and temperature adjustment method thereof

A baking device and temperature adjustment technology, which is applied to optics, instruments, electrical components, etc., can solve problems such as differences in residual film rate, and achieve the effect of improving film thickness uniformity and good film thickness uniformity

Active Publication Date: 2014-04-30
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In yellow light, the substrate has to go through processes such as cleaning, gluing, vacuum drying, exposure, soft baking, development, and hard baking. In practice, each process or process may cause differences in the residual film rate in each area of ​​the substrate.

Method used

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  • Substrate roasting device and temperature adjustment method thereof
  • Substrate roasting device and temperature adjustment method thereof
  • Substrate roasting device and temperature adjustment method thereof

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0031] Such as image 3 A specific example of the substrate baking apparatus of the present invention is shown. In this embodiment, the substrate baking device of the present invention includes a temperature adjustment mechanism 10 and a baking equipment body 6 for baking the substrate.

[0032] Such as figure 1 Shown is a specific structure of the baking equipment body 6 . The baking equipment body 6 includes:

[0033] The thermal plate 2 (as figure 2 As shown), each partition hot plate 2.1 includes a plate body and a heating member 1 arranged under the plate body; generally, the heating member 1 adopts resistance wire or heating wire, and the heating temperature of the resistance wire or heating wire is adjusted by the temperature adjustment mechanism 10 ;

[0034] The heat conduction layer 3 is arranged on the heat plate 2, and the he...

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PUM

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Abstract

The invention discloses a substrate roasting device and a temperature adjustment method thereof. The substrate roasting device comprises a roasting device main body which is used for roasting the substrate, wherein the roasting device body comprises a heating plate formed by a plurality of sub heating plates, and a temperature adjusting mechanism which is used for adjusting the heating temperature of each sub heating plate of the roasting device main body. A heat conducting layer is arranged on the heating plate, and the heat conducting layer covers each sub heating plates. Due to the adoption of the substrate roasting device, the film thickness evenness of the substrate can be improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate baking device and a temperature regulating method thereof. Background technique [0002] In the half tone technology of TFT-LCD (Thin Film Field Effect Transistor Liquid Crystal Display) four masks, the requirements for the photoresist residual film rate in each area of ​​the substrate after the yellow light process are relatively strict. Generally, it is required that the uniformity of the residual film rate after yellow light be less than 20%, and some even require the uniformity of the residual film rate to be less than 10%. The remaining film rate refers to the remaining film thickness of the unexposed part after a certain process or certain processes. In the prior art, the substrate generally takes about half an hour in a yellow light process environment. In yellow light, the substrate has to go through processes such as cleaning, gluing, vacuum drying, exposu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/38G03F7/40G02F1/1333
CPCG03F7/38G03F7/40H01L21/67103H01L21/67248H01L21/67253H01L22/12H01L22/26H01L21/68
Inventor 姚江波
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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