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A copper-clad circuit board etching process

A circuit board and copper clad laminate technology, applied in the field of copper clad circuit board etching process, can solve the problems of unenvironmental protection, increased processing cost, increased circuit board production cost, etc., and achieves the effect of low production cost and improved precision

Active Publication Date: 2016-09-28
CHONGQING HANGLING PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will increase the production cost of the circuit board, and the composition of the prepared etching potion is complicated, the treatment cost will increase in the later sewage treatment, and it is not environmentally friendly

Method used

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  • A copper-clad circuit board etching process

Examples

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Comparison scheme
Effect test

Embodiment 1

[0026] After the film-coated, exposed, and developed copper-clad laminates are washed with reverse osmosis water, they are placed in a 2m-long needle brush grinder for physical micro-etching for 20s, and then put into a 2m-long needle brush Physical micro-etching is carried out in the brush grinding machine, and at the same time, the aqueous solution containing 3% sulfuric acid and 3% hydrogen peroxide is evenly sprayed on the upper and lower surfaces of the copper clad laminate for 20s, and then enters the needle brush type with a length of 2m. Perform physical microetching in the grinding machine for 20s. Then wash its surface to neutral with RO water, and immerse it in NH with a copper ion concentration of 120g / L. 4 Soak in the mixed aqueous solution of Cl and ammonia water for 2min at 32°C, and finally wash with RO water until neutral. Remove the film of the etched copper clad laminate for section observation, there is no copper wire bridging phenomenon, the edge of the e...

Embodiment 2

[0028] After the film-coated, exposed, and developed copper-clad laminates are first washed with reverse osmosis water, they are put into a 2.2m-long needle brush grinding machine for physical micro-etching for 18s, and then into a 2.2m-long Physical micro-etching is carried out in a needle brush grinding machine, and at the same time, the aqueous solution containing 3% sulfuric acid and 3% hydrogen peroxide is evenly sprayed on the upper and lower surfaces of the copper clad laminate for 18s, and then enters the length of 2.2m. Physical microetching was carried out in a needle brush grinding machine for 18s. Then wash its surface with RO water to neutral, and immerse it in NH with a copper ion concentration of 140g / L. 4 Soak in the mixed aqueous solution of Cl and ammonia water for 1.5min at 30°C, and finally wash with RO water until neutral. Remove the film of the etched copper clad laminate for section observation, no copper wire bridging phenomenon, the edge of the etched...

Embodiment 3

[0030] After the film-coated, exposed, and developed copper-clad laminates are first washed with reverse osmosis water, they are placed in a pin brush grinder with a length of 1.8m for physical micro-etching for 23s, and then into a 1.8m-long Physical micro-etching is carried out in a needle brush grinding machine, and at the same time, the aqueous solution containing 3% sulfuric acid and 3% hydrogen peroxide is evenly sprayed on the upper and lower surfaces of the copper clad laminate for 23s, and then enters the length of 2.2m. Perform physical micro-etching in a needle brush grinder for 23s. Then wash its surface with RO water to neutral, and immerse it in NH with a copper ion concentration of 100g / L. 4 Soak in the mixed aqueous solution of Cl and ammonia water for 1.5min at 35°C, and finally wash with RO water until neutral. Remove the film of the etched copper clad laminate for section observation, no copper wire bridging phenomenon, the edge of the etched copper wire is...

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Abstract

The invention relates to a copper-covered circuit board etching technology which is low in cost and high in etching precision. The copper-covered circuit board etching technology comprises the steps that a copper-covered board after development of a front working procedure is washed through RO water to neutral, polishing is carried out on the copper-covered plate after water washing by using a needle brushing type scrubbing machine, and micro-etching liquid is evenly sprayed on the surface of the copper-covered plate, wherein the micro-etching liquid is a water solution containing sulfur acid and hydrogen peroxide; the copper-covered plate after the micro-etching is washed into the neutral through the RO water again; the copper-covered plate after the washing is immerged into etching liquid for 1-2min, and then the copper-covered plate is washed to neutral by using the RO water again. Compared with the prior art, micro copper wire bridging connection problems cannot emerge on etched circuit boards, production cost is low, special etching liquid does not need to be prepared, micro etching process is carried out on the copper-covered plate by adopting the mode of combining physic micro etching of a pin type plate brushing machine and chemical micro etching, the precision of etching process is improved greatly, and etched micro copper wires with the wire width less than 0.2mm are neat in edge.

Description

technical field [0001] The invention relates to a circuit board etching process, in particular to a copper-clad circuit board etching process. Background technique [0002] The circuit board etching process is to cover the surface of the copper plate with a film film. After exposure, plate making and development, the film on the area to be etched is removed, and then the copper plate is placed in a chemical solution. The exposed copper surface reacts with the chemical solution and is dissolved. The copper is etched away, and the copper covered by the film is retained, so that the required circuit pattern is printed on the copper surface. [0003] In the prior art, when a common etching solution is used, the etched copper-clad laminate (ie copper-clad circuit board) may have insufficient precision, or even a copper wire bridging phenomenon, that is, incomplete etching. Usually to solve this problem, it is to deal with the etching potion: configure special etching potion, som...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06
Inventor 赵勇
Owner CHONGQING HANGLING PCB
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