Wavelength conversion apparatus and light emitting device

A wavelength conversion device and wavelength conversion technology, applied in the field of luminescence, can solve problems such as phosphor efficiency decline, colloid aging, affecting the performance and life of light-emitting devices, and achieve the effect of reducing temperature and improving thermal conductivity

Inactive Publication Date: 2014-05-14
吴震
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  • Abstract
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  • Application Information

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Problems solved by technology

When the excitation light power is high, the temperature in the wavelength conversion body or layer is very high, which not only causes a decrease in ph

Method used

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  • Wavelength conversion apparatus and light emitting device

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[0013] The present invention provides a light-emitting device with a structure such as figure 1 Shown. The light emitting device includes a wavelength conversion layer 102 which is closely attached to the surface 101 a of the thermally conductive substrate 101. The light-emitting device also includes an excitation light source (not shown in the figure), the excitation light 111 emitted by the excitation light source is incident on the wavelength conversion layer, and the wavelength conversion layer absorbs the excitation light and emits the laser light 112. In this embodiment, the surface 101a of the thermally conductive substrate to which the wavelength conversion layer is attached is reflective to the received laser light, so that the light emitted by the wavelength conversion layer to the thermally conductive substrate 101 can be reflected, so that all the received laser light is directed toward figure 1 Launched from above. The reflectivity of the surface 101a of the ther...

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Abstract

The invention brings forward a wavelength conversion apparatus for absorbing exciting light and emitting excited light. The wavelength conversion apparatus comprises a wavelength conversion layer and a heat-conduction substrate. To be specific, the wavelength conversion layer includes wavelength conversion particles and first heat-conduction particles, wherein the wavelength conversion particles and the first heat-conduction particles are mixed uniformly. The heat conductivity coefficient of the first heat-conduction particle is higher than 10W/m.K; and the size D2 of the first heat-conduction particle is less than or equal to 0.5 times of the size D1 of the wavelength conversion particle and is larger than or equal to 0.05 times of the D1. The wavelength conversion layer is tightly attached to the surface of the heat-conduction substrate. According to the invention, gaps among the wavelength conversion particles are filled with the first heat-conduction particles with the specific particle sizes, thereby effectively improving the thermal conductivity of the wavelength conversion layer. Therefore, heat emitted by the wavelength conversion particles can be effectively conducted to the surface of the wavelength conversion layer and then is dissipated through the heat-conduction substrate, so that the temperature of the wavelength conversion layer is effectively reduced.

Description

[0001] technical field [0002] The invention relates to the field of light emitting technology, in particular to a wavelength conversion device and a light emitting device. [0003] Background technique [0004] At present, in the field of luminescent technology, using excitation light to excite phosphor materials has become a commonly used technology. However, as the requirements for luminous power are getting higher and higher, and the power of excitation light is getting stronger and stronger, the problem of heat dissipation of phosphors has increasingly become a bottleneck restricting this luminous technology. [0005] In the traditional method, the fluorescent powder is mixed with transparent colloids such as silica gel or epoxy resin, and cured after molding to form a wavelength conversion body or a wavelength conversion layer. In this way, the heat emitted by the phosphor is mainly absorbed by the colloids around it, and these colloids have poor thermal conductivit...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/64
CPCF21V9/40
Inventor 吴震
Owner 吴震
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