An electronic circuit and its manufacturing method and method for reducing inductance in an electronic circuit
A technology of electronic circuits and flexible circuits, applied in the manufacture of printed circuits, reduction of crosstalk/noise/electromagnetic interference (, circuits, etc.), can solve problems such as limiting the electrical performance of electronics/integrated circuits
Active Publication Date: 2017-04-12
AVAGO TECH INT SALES PTE LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
It has been found that the self-inductance of the bond wires and the mutual inductance between bond wires are significant and can limit the electrical performance of electronics / integrated circuits
Method used
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Embodiment Construction
[0020] The following describes in detail the preferred embodiments of the present invention with reference to the accompanying drawings.
[0021] Traditional wire bonding techniques use multiple bonds in an attempt to achieve lower inductance. figure 1 Used to illustrate traditional wire bonding techniques. Bond wires have inductance that limits the bandwidth of many designs. There is an opportunity to limit the inductance, however, it requires a similar bond wire arrangement with the current direction opposite to the original signal. This opposite current flow is impractical in many situations, including figure 1 The example shown in . More specifically, studies have shown that the mutual inductance between parallel bond wires 102 is greater than their ability to cancel inductance when configured according to conventional wire bond technology. That is, the mutual inductance between parallel bonding wires 102 limits the overall possible reduction in inductance.
[0022] T...
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Abstract
The invention relates to an electronic circuit with low inductance connections. The electronic circuit includes a ground plane and flex circuit. The flexible circuit has a first surface generally facing the ground layer and a second surface opposite the first surface. The flex circuit also defines a flex bridge. The electronic circuit further includes a first electronic device communicatively coupled to the second surface of the flexible circuit, and a second electronic device communicatively coupled to the second surface of the flexible circuit, at least one conductive trace in the electronic device A wire is defined on the second surface of the flex circuit and extends along the flex bridge. One end of the at least one conductive trace is configured to receive outbound current from the first electronic device, and the other end of the at least one conductive trace is communicatively coupled to the second electronic device through the vertical interconnection path.
Description
technical field [0001] The present invention relates to the field of bonding wire technology, and more particularly to a method for providing low inductance connections for transistors and other devices in electronic circuits. Background technique [0002] Wire bonding is a method of forming interconnections between integrated circuits (ICs) and printed circuit boards (PCBs) during semiconductor device assembly. Inductance is the property of a conductor by which a change in current in a conductor induces a voltage in the conductor itself (self-inductance) and nearby conductors (mutual inductance). It has been found that the self-inductance of the bond wires and the mutual inductance between bond wires are significant and can limit the electrical performance of electronics / integrated circuits. There is a need to provide a method for providing low inductance connections for transistors and other devices in electronic circuits. Contents of the invention [0003] Embodiments...
Claims
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IPC IPC(8): H05K1/02H05K1/11
CPCH01L2224/48472H01L2224/49111H01L2224/49175H01L2924/30107H01L2924/3011H01L23/5387Y10T29/4913H01L2924/00H05K1/028H05K3/4691H05K2201/042H01L23/4985H05K1/0216H05K3/306
Inventor 唐纳德·R·拉特瑞尔瑟德·E·阿得利彼得·科斯詹姆森·F·麦克唐纳罗斯·S·威尔逊
Owner AVAGO TECH INT SALES PTE LTD