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A method for processing blind holes in ultra-thin flexible circuit boards

A technology of flexible circuit boards and processing methods, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as poor machinability, ensure machinability, improve product reliability and product yield, and reduce manufacturing costs. cost effect

Inactive Publication Date: 2016-09-07
杨秀英
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

9 or 12um raw materials, if the double-sided direct thinning process is adopted, a large number of blind holes will still be scrapped during laser processing or hole treatment before copper plating, and the machinability is poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention will be specifically introduced below in conjunction with specific embodiments.

[0017] A blind hole processing method for ultra-thin flexible circuit boards. The raw materials used are double-sided flexible circuit boards. The double-sided flexible circuit boards are composed of: A-side flexible circuit board, B-side flexible circuit board, which is attached to A-side flexible circuit The insulating film between the board and the B-side flexible circuit board, the processing method includes the following steps:

[0018] (1) Steps for punching the B-side flexible circuit board: a. Use a laminating machine to attach the protective film to the A-side flexible circuit board; the role of the protective film is to prevent the effective area of ​​the A side copper foil from being subjected to the next processing process Corrosion or damage. b. Use a solvent to thin the B-side flexible circuit board into a B-side thin flexible circuit board; c. Use a laser m...

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PUM

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Abstract

The invention discloses an ultra-thin flexible circuit board blind hole machining method. A raw material is a double-face flexible circuit board which comprises a face A flexible circuit board body, a face B flexible circuit board body and an insulating film attached to the position between the face A flexible circuit board body and the face B flexible circuit board body. The machining method includes the following steps of (1) punching the face B flexible circuit board body and (2) punching the face A flexible circuit board body. During single-face blind hole machining, double-face blind hole machining and machining of a product with a copper thickness of 12 micrometers or smaller than 12 micrometers, good machining performance and quality guarantee can be guaranteed during laser machining or other manufacturing procedures, and accordingly machinability of the product is guaranteed; reliability and the yield of the product can be greatly improved, and manufacturing cost is reduced.

Description

Technical field [0001] A blind hole processing method for a circuit board, and a blind hole processing method for an ultra-thin flexible circuit board. Background technique [0002] In recent years, as electronic products become lighter and more versatile, the wiring density of internal flexible circuits is required to be higher and higher, and products with single-sided blind vias or double-sided blind vias continue to appear. At the same time, in order to achieve the characteristics of softness, bending resistance and thinner, the final copper thickness of the product is also very thin, that is, the raw material insulation layer is required, and the thickness of the final product copper layer is relatively thin. Due to the unreliability of laser head output energy and the fluctuation of copper thickness and insulating layer thickness during laser processing of blind holes, when the copper foil is thin, laser processing and post-processing processes will cause a large number of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 杨秀英
Owner 杨秀英
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