Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer Automatic Test System

An automatic test system and wafer technology, applied in the semiconductor field, can solve the problem of inaccurate test results of the automatic wafer test system

Active Publication Date: 2016-03-09
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] The problem solved by the present invention is that the test result of the automatic wafer test system in the prior art is inaccurate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer Automatic Test System
  • Wafer Automatic Test System
  • Wafer Automatic Test System

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] After discovery and analysis, in the prior art, wafer automatic test system 1 (reference figure 1 ) The reasons for the inaccurate test results are as follows:

[0038] refer to figure 2 and image 3 , the probe card 16 of the automatic wafer test system 1 is a printed circuit board, including several male connectors 18 correspondingly connected to the female connectors of the coaxial cable, probes 162 and electrically connecting the male connectors 18 and the probes 162 The microstrip line 161 . After the test signal received by the male joint 18 on the probe card 16, the test signal is transmitted to the probe 162 through the microstrip line 161, and the ground line 163 is around the microstrip line, which can minimize the loss of signal.

[0039]When the automatic wafer testing system 1 in the prior art performs wafer testing, the mechanical calibration kit or the electronic calibration unit only calibrates the test plane to the end face of the male connector 18...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an automatic test system for a wafer. The automatic test system comprises a probe card, a probe station, a wafer boat for holding the wafer, and a manipulator for conveying the wafer between the wafer boat and the probe table, wherein the probe table is provided with a chuck for holding the wafer or a cleaning disk for cleaning a probe on the probe card. The automatic test system further comprises a test data calibration piece which is arranged on the chuck or the cleaning disk and is used for calibrating a test plane to the end face of the point of a probe. The test data calibration piece arranged on the chuck or the cleaning disk can used for correcting an error between a male joint corresponding to the female joint of a coaxial cable and the point of the probe to obtain high-accuracy test data. Moreover, automation of the contact calibration process of the probe on the probe card and the test data calibration piece as well as the test process of a microwave device to be tested on the wafer to be tested can be realized. The automatic test system is suitable for batch test, and batch accurate test data can be obtained.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a wafer automatic testing system. Background technique [0002] The microwave device is a device working in the microwave band, and the frequency of the microwave band is 300-300000 MHz. Microwave devices are divided into microwave oscillators, power amplifiers, mixers, detectors, microwave antennas, microwave transmission lines, etc. according to their functions. There are mainly two forms of microwave devices on chips arranged in wafers, one is a microwave module in a system on chip (SOC System on Chip), and the other is a discrete microwave device in a chip. [0003] In the prior art, after the microwave device is manufactured on the wafer, it is necessary to perform an electrical test on the microwave device on the wafer. This electrical test is part of the wafer test (CP test, ChipProbing) to ensure that before packaging, Each microwave device on the wafer is a qualified prod...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26
Inventor 王磊
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP