Solid laser module of semiconductor laser pump

Abstract

The invention discloses a solid laser module of a semiconductor laser pump, relating to the technical field of semiconductor lasers. The solid laser module comprises a split upper shell, a split lower shell, a core assembly positioned between the split upper shell and the split lower shell, a water pipeline which is positioned on the split lower shell and is communicated with the core assembly, and a water nozzle which is positioned on the outer side of the water pipeline and is connected with the water pipeline, wherein the core assembly comprises an outer water sealing piece, an inner water sealing piece, a first sealing rubber ring, a second sealing rubber ring, a fixing structural part and a laser array; the inner water sealing piece comprises an end portion and a hollow cylindrical guide barrel fixedly connected with the end portion; the guide barrel is provided with a plurality of turbulence holes; the outer diameter of the end portion is the same as the diameter of the inner cavity of the fixing structural part; the outer diameter of the guide barrel is smaller than the outer diameter of the end portion. By adopting the laser module, the water resistance is reduced, the water flow is increased, the heat dissipating capacity is improved, the forms and quantity of assembled parts are simplified, the difficulty of an assembly process is lowered, and the consistence of the assembly batch is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to a solid-state laser module pumped by a semiconductor laser. Background technique [0002] The solid-state laser module is the core optoelectronic device of the laser marking machine, which is widely used in communication, electronics, machinery, packaging and other industries. The current mainstream products use semiconductor lasers as pump sources to pump laser crystals and finally output 1064nm laser beams. With the further maturity of semiconductor laser manufacturing technology, the design and production level of semiconductor-pumped solid-state laser modules have been improved accordingly. Although the emission spectrum of the semiconductor laser pump source has been greatly improved compared with the early xenon lamp pump source, and the thermal effect and birefringence effect have been significantly reduced, the problem of heat dissipation still exists, which...

AI Technical Summary

Problems solved by technology

[0004] Disadvantages of the existing technology: First, the water resistance is relatively large. In the existing structural design, a large number of positioning screws are used for waterway sealing, and the waterway channel is restricted after assembly, which limits the water flow and affects the heat dissipation capacity; secondly, The assembly is complicated. The end of the core component needs to be assembled in sequence with the inner sealing water part 2, the inner sealing water part 1, and the corresponding rubber ring to complete the assembly. The gap between the two sealing water parts is narrow, and the inner sealing water part 2 itself The thickness is thin, it is not easy to assemble tightly, the internal resistance of the waterway is reduced, the assembly is difficult, and it is easy to cause inconsistent assembly batches

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